Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
It’s Only Common Sense: Your Biggest Competitor Is Complacency
The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
Applied Materials Appoints Teri Little as Senior Vice President and Chief Legal Officer
June 9, 2020 | GlobeNewswireEstimated reading time: 1 minute
Applied Materials, Inc. announced that Teri Little has joined the company as senior vice president and chief legal officer. Previously, Ms. Little served as executive vice president, chief legal officer and corporate secretary at KLA Corporation where she led the legal affairs of the company worldwide, including corporate securities and governance, M&A, intellectual property, commercial, employment, compliance and litigation.
“As our new chief legal officer, Teri brings broad legal experience as well as deep knowledge and understanding of the semiconductor industry and our customers,” said Gary Dickerson, president and CEO. “As we enter the era of artificial intelligence and big data, Applied’s opportunities have never been greater and Teri’s leadership and insight will help accelerate our strategy.”
“I am very excited to be joining Applied Materials, the industry leader and a company that I have long admired,” said Teri Little. “I look forward to working alongside Gary, the legal team and groups throughout the company to pursue new opportunities and markets where Applied can bring unique advantages.”
Prior to her 18 years at KLA, Ms. Little was with the law firms of Wilson Sonsini Goodrich & Rosati, as well as Heller Ehrman White & McAuliffe. She received her J.D. from Stanford University Law School and a B.S. in finance from San Jose State University.
Tom Larkins, senior vice president and general counsel of Applied Materials, announced his decision last fall to retire after leading Applied Materials’ law department since 2012.
“I want to thank Tom for his contributions to Applied Materials. Today, our legal team is better than ever. Tom built a very strong team that is a great partner all across the company. Tom will support Teri during the transition, and I wish him well for the future,” said Dickerson.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Sealed for Survival: Potting Electronics for the Toughest Environments
10/29/2025 | Beth Massey, MacDermid Alpha Electronics SolutionsElectronics deployed in harsh conditions face relentless threats from vibration, impact, chemical contaminants, airborne pollutants, and moisture, conditions that can quickly lead to failure without robust protection. Potting, the process of encapsulating electronics in a protective polymer, is a widely used strategy to safeguard devices from both environmental and mechanical hazards.
Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
10/28/2025 | Kurt Palmer -- Column: Driving InnovationRigid-flex printed circuit boards are a highly effective solution for placing complex circuitry in tight, three-dimensional spaces. They are now indispensable across a range of industries, from medical devices and aerospace to advanced consumer electronics, helping designers make the most efficient use of available space. However, their unique construction—combining rigid and flexible materials—presents a fundamental challenge for PCB manufacturers.
SMTAI 2025 Review: Reflecting on a Pragmatic and Forward-looking Industry
10/27/2025 | Marcy LaRont, I-Connect007Leaving the show floor on the final afternoon of SMTA International last week in Rosemont, Illinois, it was clear that the show remains a grounded, technically driven event that delivers a solid program, good networking, and an easy space to commune with industry colleagues and meet with customers.
ITW EAE Despatch Ovens Now Support ASTM 5423 Testing
10/15/2025 | ITW EAEAs the demand for high-performance electrical insulation materials continues to grow—driven by the rapid expansion of electric vehicles (EVs) and energy storage systems—thermal processing has become a critical step in material development.
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).