PV Nano Cell Signs Agreement with Healthcare Giant to Develop Sensors Digital Printing Solution
June 10, 2020 | Globe NewswireEstimated reading time: 2 minutes
PV Nano Cell Ltd, an innovative provider of inkjet-based conductive digital printing solutions and producer of conductive digital inks, announced that it has signed, under NDA, an agreement with a well-known, world-leading multinational healthcare company to develop a new inkjet printing technology for the fabrication of sensors using resistor and gold inks.
As part of the funded project, PV Nano Cell will develop two project-dedicated inks. The first ink is a high resistance ink – resistor ink and the second ink is a gold based ink. After the successful completion of the ink development, PV Nano Cell will develop the printing process technology to allow mass-production inkjet printing of the sensors. The resistor ink is based on PV Nano Cell prior work and knowledge, developing breakthrough materials and process technologies for embedded passive components.
PV Nano Cell’s Chief Executive Officer, Dr. Fernando de la Vega, commented, “We are honored to have been selected by this world-renowned multinational company for the project. The technology we are developing is expected to result in a dramatic drop in the current cost of fabricating the sensors. PV Nano Cell is working on further developing and expanding of its technology to print embedded passive components. We have already printed resistors and also capacitors using conductive and dielectric ink and believe this is a strategic development applicable to many markets and applications. As recently announced, sensor solutions provider HENSOLDT together with Printed Electronics (PE) provider, Nano Dimension Ltd., recently succeeded in assembling the world-wide first 10-layer inkjet printed circuit board (PCB). The board carries a high-performance electronic structures soldered to both outer sides. We believe such advancements prove the need and feasibility of embedded passive components.”
PV Nano Cell’s Chief of Business Development Officer, Mr. Hanan Markovich commented, “The technology we are now developing is expected to have a dramatic impact on the bottom-line cost of production of our partner’s sensors. The development is well on its way and we’re expecting to meet all milestones as planned. We look forward to finish the development of the two inks and start working on the printing process. During the project, our DemonJet printer will be used to print both the resistor and gold inks. We further plan to use our printer to print dielectric ink as well. Using our 10 channels print head, the DemonJet is capable of printing multiple materials and thus print embedded passive components.”
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).