Leonardo DRS Awarded $120 Million Contract for DAIRCM Aircraft Protection Systems
July 20, 2020 | Leonardo DRSEstimated reading time: 1 minute
Leonardo DRS, Inc. announces that it has received a contract from the U.S. Naval Air Systems Command to provide engineering design and test hardware for AN/AAQ-45 Distributed Aperture Infrared Countermeasure (DAIRCM) advanced aircraft protection systems. The mixed cost-plus-incentive-fee and firm-fixed-price, contract is worth $120 million.
This contract follows the previous Joint Urgent Operational Needs program that resulted in the system being fielded on U.S. Air Force, Army and Navy platforms. This Engineering and Manufacturing Development program will continue to develop, integrate and test improved capabilities to keep pace with enhanced and future threats.
Under the newly awarded follow-on contract, Leonardo DRS will provide non-recurring engineering to design, develop, integrate and test engineering development models as well as production representative models of weapons replaceable assemblies for government testing. The system has an open and scalable architecture that allows it to be optimized for various type/model/series aircraft. The low size, weight and power design of the system supports a range of rotary and tilt-wing aircraft throughout the services, including application to the emerging future vertical lift programs.
“Leonardo DRS is proud to provide these state-of-the-art systems to enhance aircraft protection throughout the fleet,” said John Baylouny, executive vice president and chief operating officer of Leonardo DRS. “This continued strong partnership with our customer has produced technologies that will offer advanced capabilities, including combat survivability for flight crews while supporting their ability to accomplish diverse mission sets for years to come.”
The AN/AAQ-45, DAIRCM, is at the forefront of aircraft defensive protection technology and was developed by Leonardo DRS through three of its business units: Airborne & Intelligence Systems, Daylight Solutions, and Electro-Optical & Infrared Systems. As missile and other anti-aircraft threats continue to evolve and expand around the world, frontline helicopters will require a small but capable system to defeat these threats.
Work on this contract will be performed in the Leonardo DRS facilities in Dallas; San Diego; Fort Walton Beach, Fla.; and Melbourne, Fla. and is expected to be completed in 2024.
Suggested Items
Real Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products
05/01/2024 | Real Time with...IPC APEX EXPOChris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.
IPC's Vision for Empowering PCB Design Engineers
04/30/2024 | Robert Erickson, IPCAs architects of innovation, printed circuit board designers are tasked with translating increasingly complex concepts into tangible designs that power our modern world. IPC provides the necessary community, standards framework, and education to prepare these pioneers as they explore the boundaries of what’s possible, equipping engineers with the knowledge, skills, and resources required to thrive in an increasingly dynamic field.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.