Arm and DARPA Partner to Accelerate Technological Innovation
August 21, 2020 | Business WireEstimated reading time: 1 minute

Arm announced a three-year partnership agreement with the U.S. Defense Advanced Research Projects Agency (DARPA), establishing an access framework to all commercially available Arm® technology. With DARPA’s Electronics Resurgence Initiative gaining momentum, the new agreement will enable the research community that supports DARPA’s programs to quickly and easily take advantage of Arm’s leading IP, tools and support, accelerating innovation in a variety of fields.
“The span of DARPA research activity opens up a huge range of opportunities for future technological innovation,” said Rene Haas, president, IP Products Group, Arm. “Our expanded DARPA partnership will provide them with access to the broadest range of Arm technology to develop compute solutions supported by the world’s largest ecosystem of tools, services and software.”
With more than 170 billion Arm-based chips shipped to date, Arm offers the industry’s most proven IP, providing distributed intelligence from cloud to edge and endpoint. The expanded partnership enables DARPA researchers to have the flexibility and scalability to access vertical market compute from small embedded sensors to high-performance systems.
“DARPA’s programs within the Microsystems Technology Office (MTO) focus on the most advanced challenges in microelectronics; equipping our community with best in class technologies is essential not only for break-through scientific and engineering advances, but also for improved transition into military and commercial applications,” stated Serge Leef, who leads design automation and secure hardware programs in MTO.
To support the work DARPA does, multidimensional collaboration is key. An Arm IP license gives the DARPA community a portal to the world’s largest open compute ecosystem of silicon designers and software developers, enabling the lowest SoC build costs and smallest risk profile. Projects can transition from concepts to real-world deployments in a fast and efficient way, with guidance on everything from hardware verification to physical implementation and software development.
Suggested Items
Jabil Announces Appointment of New Director to the Board
04/21/2025 | Jabil Inc.Jabil Inc., a global engineering, supply chain, and manufacturing solutions provider, announced that Sujatha Chandrasekaran has been appointed to its Board of Directors.
NASA Aims to Fly First Quantum Sensor for Gravity Measurements
04/18/2025 | NASAA lumpy, colorful 3D model of the Earth against a black background, illustrating variations in gravity. North and South America are visible. Red areas show higher gravity, blue areas show lower gravity.
Hanon Systems Wins Third PACE Award for Visible-Light LED Photocatalyst Technology
04/18/2025 | PRNewswireHanon Systems, a leading global automotive thermal management supplier and subsidiary of Hankook & Company Group, has been named a winner of the 2025 PACE Awards. This marks the company's third win, making it the first Korean supplier to achieve this recognition.
Indium Experts to Present on Power Electronics at PCIM Europe 2025
04/17/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 6-8, in Nuremberg, Germany.
Real Time with... IPC APEX EXPO 2025: Emerging Trends in Design and Technology
04/16/2025 | Real Time with...IPC APEX EXPOAndy Shaughnessy speaks with IPC design instructor Kris Moyer to discuss emerging design trends. They cover UHDI technology, 3D printing, and optical data transmission, emphasizing the importance of a skilled workforce. The role of AI in design is highlighted, along with the need for understanding physics and mechanics as designs become more complex. The conversation concludes with a focus on enhancing math skills for better signal integrity.