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TSK Schill GmbH Supplies Rohde & Schwarz with New Chemical Tin Line
September 18, 2020 | TSK Schill GmbHEstimated reading time: Less than a minute

After on-schedule delivery and successful installation of a horizontal chemical tin line at Rohde & Schwarz’s Teisnach plant, the customer is now equipped for the future. TSK has also succeeded in implementing the requirements of this project with high precision and quality. The new line is now in the qualification phase.
Thanks to the renewed extraordinarily good cooperation and planning between Rohde & Schwarz and TSK, this joint project was successfully implemented.
"We are again very proud to have implemented another project with Rohde & Schwarz and look forward to future projects," says Managing Director Thomas Schill.
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Connect the Dots: The Future of PCB Design and Manufacturing
07/02/2025 | Matt Stevenson -- Column: Connect the DotsFor some time, I have been discussing the increasing complexity of PCBs and how designers can address the constantly evolving design requirements associated with them. My book, "The Printed Circuit Designer’s Guide to… Designing for Reality," details best practices for creating manufacturable boards in a modern production environment.
Project GENESIS Minimizes Ecological Footprint in Europe’s Semiconductor Industry
06/06/2025 | Fraunhofer IPMSA pan-European consortium dedicated to developing sustainable processes and technologies for the semiconductor-manufacturing supply chain announces the launch of the GENESIS project.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
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