Thinfilm Announces First Multi-Cell Solid-State Battery
October 15, 2020 | Globe NewswireEstimated reading time: 1 minute
Thin Film Electronics ASA, a developer of ultrathin, flexible, and safe energy storage solutions for wearable devices and connected sensors, announced significant progress in device manufacturing and packaging innovation in support of its premium microbattery products based on solid-state lithium battery ("SSLB") technology.
To enable ultra-compact, energy-dense, milliamp-hour-class batteries, Thinfilm has successfully demonstrated the first multi-cell battery based on its SSLB technology. By stacking and encapsulating multiple layers of active cell materials deposited on Thinfilm's unique stainless steel substrate, Thinfilm can flexibly scale energy storage capacity within the compact footprint required in applications with constrained form factors.
Innovations in steel-substrate cell stacking are essential to creating solid-state battery products for hearing aids, earbuds, on-body sensors, and other products prioritizing size and shape. By overcoming packaging limitations that have previously prevented wider use of solid-state technology, Thinfilm is expanding the technology's many benefits to previously unaddressed markets.
Thinfilm's consolidated manufacturing environment in Silicon Valley continues to accelerate technology and product development cycles and has led to ongoing improvements in device yield, reliability, and performance of the critical materials responsible for energy storage and charge cycling. As a result, Thinfilm's battery development engineers have recently implemented and validated multiple process integration and materials advancements in the Company's on-site, fully functional, and scale-ready flexible electronics factory.
Based on continued positive feedback regarding the advantages of Thinfilm SSLB technology, the Company has broadened its engagements with leading manufacturers of wearable devices and connected sensors. Substantive conversations with a growing list of prospects have validated Thinfilm's stated market priorities and led to the incorporation of meaningful customer feedback in the Company's SSLB roadmap and technology development priorities. For example, recent success in multi-cell stacking reflects the prioritization of energy-dense batteries suitable for integration into form-factor-constrained applications such as hearing aids, earbuds, and medical devices. Improved cycling counts, compared to legacy lithium-ion batteries, address the long-term reliability needs of devices requiring daily charging. Enhanced output currents enable reliable Bluetooth LE transmit performance needed to communicate on-body vital sign sensor data to a companion smartphone.
Suggested Items
Aeluma Secures NASA Contract to Advance Quantum Dot Photonic Integrated Circuits for Aerospace and AI Applications
11/25/2024 | ACCESSWIREAeluma, Inc., a semiconductor company specializing in high-performance, scalable technologies for mobile, automotive, AI, defense and aerospace, communication and quantum computing, announced it has been awarded a contract by NASA to develop quantum dot photonic integrated circuits (PICs) on silicon.
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.