NetVia Group, LLC Joins Forces with Epec Engineered Technologies
November 13, 2020 | Epec Engineering TechnologiesEstimated reading time: 1 minute
NetVia Group, LLC and Epec Engineered Technologies announced that the two companies are joining forces to give customers a greater range of high-quality services and long-term financial strength.
Epec LLC, founded in 1952, is one of the fastest-growing, high-technology electronics companies in North America, designing and manufacturing high-reliability products, including printed circuit boards, flex/rigid-flex PCBs, custom battery packs, user interfaces, RF products, cable assemblies, CNC machined parts, and flexible heaters for OEMs around the world.
NetVia Group was founded more than 35 years ago, is a trusted manufacturer of time-sensitive, high-technology printed circuit boards for OEMs in the most demanding industries.
The acquisition of the Netvia Group into the Epec family brings together two companies that share the same values and passionate customer commitment of engineering excellence, superior quality, customer dedication, and on-time delivery.
Jeff Forbus, President of NetVia, stated: "After working with the team over the past several years, we have the highest respect and regard for Epec as a successful industry leader, with a proven long-term growth plan that will give our valued customers great support and services."
Ed McMahon, CEO of Epec, commented: "We are very excited and welcome NetVia Group and their employees into the growing Epec family. Jeff and his dedicated team have built a tremendous reputation, which seamlessly fits into Epec's proven manufacturing capabilities, and over 95% first-time-right, quick-turn, on-time delivery.
"Jeff and I are confident of a seamless transition, as all of NetVia's customers will work long-term with the same sales, customer service, and engineering employees, as we expand the manufacturing, inspection, and engineering capabilities at the Irving, Texas, location. Together, Jeff and I look forward to capitalizing on our complementary capabilities and growing our business for many years to come."
Suggested Items
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
SIA Praises Finalization of CHIPS Investments for GlobalFoundries Manufacturing Projects
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding finalization of semiconductor manufacturing investments announced by the U.S. Department of Commerce and GlobalFoundries.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.