-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueMoving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Hari Pillai Rejoins Sanmina as President of Components Technology
January 6, 2021 | Sanmina Corp.Estimated reading time: 1 minute

Sanmina Corporation, a leading integrated manufacturing solutions company that manufactures some of the world's most complex and innovative electronic, optical and mechanical products, has announced that Hari Pillai has rejoined the company as President of Components Technology. Pillai brings to Sanmina more than 25 years of operational leadership experience in the technology industry.
The addition of Pillai to the organization aligns with the Company's previously announced plan to operate in three businesses to unlock the total value of Sanmina. Pillai joins two distinguished individuals and rounds out the leadership for Integrated Manufacturing Solutions (IMS), SCI (defense products and system builds) and Components Technology (advanced interconnect technology and mechanical systems).
"We are excited to have Hari rejoin the organization. His broad experience and knowledge of Sanmina, combined with the strength of our leadership team, is unsurpassed in the industry," stated Jure Sola, Chairman and CEO of Sanmina. "His strong background leading global operations in high complexity, heavily regulated markets is well aligned with Sanmina's long term strategy. I am confident that Hari's leadership will drive the Component Technology business strategy to accelerate profitable growth and capitalize on synergies across the organization."
Pillai most recently served as Executive Vice President, Customer Installations Group at Bloom Energy, where he was responsible for leading a team of professionals from engineering, program management and supply chain management, ensuring high quality installations. Prior to Bloom, he was Chief Executive Officer and President of Contec Holdings, a global provider of test technology and OEM warranty services to broadband service providers. Pillai's career includes 17 years with Sanmina where he held various leadership roles including President and Chief Operating Officer and Executive Vice President, EMS division. During his tenure, he was instrumental in the transformation of Sanmina to a leading end-to-end global EMS provider.
Pillai is a graduate of Trinity College at the University of Dublin in Ireland, where he received his B.Sc. in Management and of the Smurfit School of Business at University College Dublin where he received his Master in Business (MBS) with First Class Honors.
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.