Toward Imperceptible Electronics That You Cannot See or Feel
January 11, 2021 | Osaka UniversityEstimated reading time: 1 minute

Transparent electronics—such as head-up displays that allow pilots to read flight data while keeping their eyes ahead of them—improve safety and allow users to access data while in transit. For healthcare applications, the electronics need to not only be cheap and straightforward to fabricate, but also sufficiently flexible to conform to skin. Silver nanowire networks meet these criteria. However, current methods of development create random nanowire alignment that's insufficient for advanced applications.
In an upcoming study in Advanced Intelligent Systems, researchers from Osaka University have used high-resolution printing to fabricate centimeter-scale cross-aligned silver nanowire arrays, with reproducible feature sizes from 20 to 250 micrometers. As a proof-of-concept for functionality, they used their arrays to detect electrophysiological signals from plants.
The researchers first created a patterned polymer surface to define the subsequent nanowire feature size. Using a glass rod to sweep silver nanowires across the pattern led to either parallel or cross-aligned nanowire networks, depending on the direction of the sweep. Nanowire cross-alignment, alignment within the pattern, and electro-optical properties were impressive.
"The sheet resistance of patterns less than 100 micrometers ranged from 25 to 170 ohms per square, and the visible light transmittance at 550 nanometers was 96% to 99%," says Teppei Araki, co-senior author. "These values are well-suited for transparent electronics."
The researchers showed off the utility of their technology by monitoring the electric potential of Brazilian waterweed leaves. Because the nanowire arrays are transparent, the researchers were able to keep the leaf under visual observation while acquiring data over long periods of time. A 2- to 3-micrometer-thick device conformed to the surface of a leaf without causing damage.
"Our microelectrodes-based organic field-effect transistors exhibited excellent multi-fuctionality," says Tsuyoshi Sekitani, co-senior author. "For example, transparency of 90%, the on–off ratio was ~106, and the leakage current remained stable upon bending at a radius of 8 millimeters."
Transparent electronics is an emerging technology. It must be simple and inexpensive to mass-produce for biomedicine, civil engineering, agriculture, and other applications that require underlying visual observation. The advance described here is an important step in that direction. The Osaka University researchers plan on making further technical improvements, such as incorporating graphene onto the nanowire’s surface. This will improve the uniformity of the microelectrodes' sheet resistance. Ultimately, the researchers' technology will help minimize the raw material input of electronics, and exceed the functionality of conventional non-transparent electronics.
Read the original article, here.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
A.R.T. Invests in Latest Equipment to Further Enhance Electronics Training Facilities
09/17/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, has announced a series of new equipment investments at its state-of-the-art training centre.
Richardson Electronics Appoints Daniel Albers to Drive Made-in-USA Contract Manufacturing Expansion
09/17/2025 | Globe NewswireRichardson Electronics, Ltd., a global provider of engineered solutions for the green energy, power management, and custom display markets, announced the appointment of Daniel Albers to spearhead business development for its expanded, Made-in-USA contract manufacturing efforts.
STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
09/17/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.
Indium President and CEO to Deliver ELCINA CEO Forum Keynote at Productronica India
09/17/2025 | Indium CorporationIndium Corporation President and CEO Ross Berntson will deliver the Electronic Industries Association of India (ELCINA) CEO Forum keynote at Productronica India, to be held September 17-19 in Bengaluru, India.
TTCI and The Training Connection Strengthen Electronics Manufacturing with Test Services and Training at PCB West 2025
09/16/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB West 2025, taking place Wednesday, October 1, 2025, at the Santa Clara Convention Center in California. Visitors are invited to Booth 113 to explore the companies’ complementary expertise in test engineering services and workforce development for the electronics industry.