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The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1

10/15/2025 | Steve Williams -- Column: The Right Approach
There is no bronze bust in the lobby or portrait in the conference room of Electro-Tek's founder—my Dad, Charles “Chuck” Williams—so with the facility closing last year after 56 years, I feel it is time to tell the story. Chuck Williams founded Electro-Tek in 1968 in our basement, eventually moving into the second floor of an old 1913 building in downtown Milwaukee that is still standing (the first of three eventual facilities).

LPKF Joins productronica’s 50th Anniversary, Showcasing Laser Technology for Electronics Manufacturing

10/10/2025 | LPKF Laser & Electronics
LPKF Laser & Electronics invites visitors to productronica 2025 in Munich from November 18 to 21. At booth 305 in hall B2, the company will present its portfolio of modern laser technologies for the electronics industry live – from prototyping systems and high-performance depaneling to laser plastic welding for electronic housings and thin glass processing for advanced packaging.

Marco Pieters Appointed ASML Chief Technology Officer

10/09/2025 | ASML
ASML Holding NV (ASML) announced the appointment of Marco Pieters as Executive Vice President and Chief Technology Officer, reporting to President and Chief Executive Officer, Christophe Fouquet.

Advanced Rework Technology Inspires Students at National Manufacturing Day 2025

10/08/2025 | A.R.T. Ltd.
Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, joined forces with Jaltek, a UK-based electronics manufacturer with over 35 years’ experience in designing and producing high-quality electronic products, to deliver hands-on workshops for students during National Manufacturing Day 2025.

I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series

10/10/2025 | I-Connect007
In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.
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