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From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
February 5, 2021 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes

Another active news week in the electronics industry! February is launching with a high-G burn, to be sure. And if you’re a fan of The Expanse, like I am, then you’ve probably already watched through to the Season 5 finale; this means you have attention to spare for industry news all of a sudden. And if you haven’t reached the current end of the line for The Expanse, then today’s list is just what you need while you catch up.
This week, the five news Items you simply need to read include details about IPC APEX EXPO, and EMS market news from IPC as well. We also have new loss modeling software, AS9100 compliance news, and a stackup discussion. IPC APEX EXPO 2021 is fast approaching; don’t forget to preview the new virtual program with the February issue of SMT007 Magazine, available now.
IPC APEX EXPO 2021 Offers More than 100 Future-focused Educational Opportunities
Published February 1
Changing technologies, advanced materials and the driving force of new processes will take center stage throughout the IPC APEX EXPO 2021 technical conference and professional development sessions, which will take place virtually March 8-12. Dr. John Mitchell, IPC president, points out a unique benefit to this year’s format, “Even if you can’t see some sessions live—you have 90 days to catch up on what you missed. Now for the first time, you can see and experience all of the content you might have missed in the past!”
Wild River ISI-56 Platform Accelerates SerDes Testing
Published February 2
Al Neves, founder and CTO of Wild River Technology, updates Andy Shaughnessy on the release of their new ISI-56 loss modeling platform. Al explains why it was so critical that this tool meets the stringent requirements of the IEEE P370 specification (which he helped develop), and why he believes this is currently the best tool for SerDes testing and characterization.
North American EMS Industry Sales up 8.5% in December
Published January 29
IPC announced the December 2020 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. Spoiler alert: the book-to-bill ratio stands at 1.10. Read the rest of the article for more detail.
Seven Tips for Your Next Stackup Design
Published February 1
As Eric Bogatin shares, “rarely do we have the luxury of designing a board just for connectivity. When interconnects are not transparent, we must engineer them to reduce the noise they can generate. This is where design for signal integrity, power integrity and EMC—collectively high-speed digital engineering—are so important.”
Ventec UK Continues to Maintain Highest AS9100 D Quality Compliance
Published February 1
Ventec International Group Co., Ltd. is pleased to announce that the company’s European headquarters in Leamington Spa, UK, continues to maintain the highest AS9100 Revision D compliance in accordance with the Aerospace Supplier Quality System Certification Scheme following successful completion of its surveillance audit.
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S&K Aerospace Awarded Major Contract Under DLA Maritime Acquisition Advancement Program
07/02/2025 | BUSINESS WIRES&K Aerospace, LLC has been awarded a significant contract under the Defense Logistics Agency’s (DLA) Maritime Acquisition Advancement Program, managed by the U.S. Naval Supply Command - Weapon Systems Support (NAVSUP WSS) in Mechanicsburg, PA.
Green Circuits to Exhibit Full-Service Electronics Manufacturing Solutions at 2025 SMD Symposium
07/02/2025 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is pleased to announce its participation in the 2025 SMD Symposium, taking place August 5-7 at the Von Braun Center in Huntsville, Alabama.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
RTX, the Singapore Economic Development Board Sign MOU Outlining 10-year Growth Roadmap
06/20/2025 | RTXRTX and the Singapore Economic Development Board (EDB) have signed a Memorandum of Understanding (MoU) which outlines a 10-year roadmap to further long-term strategic collaboration in Singapore.