The Chemical Connection: Surface Finishes for PCBs
It’s Only Common Sense: 7 Tips to Focus on What Works
The Marketing Minute: Go Big or Go Home—Long-form Content Is Your Brand’s Best Friend
Ventec, BizLink, Footprintku Announce Strategic Alliance
February 26, 2021 | VentecEstimated reading time: 1 minute
Ventec is pleased to announce that it has entered into a global strategic alliance with leading interconnect solutions provider, BizLink Holding Inc., and Footprintku Inc., an online EDA library and digital transformation services provider for electronic components. This alliance is formed to provide a solution that boosts product development process efficiency and shortens development and time-to-market.
BizLink has long been a supplier of key components to the IT industry, including connectors and cables. The company is experienced in new product introduction (NPI) as well as in system integration, manufacturing, and in assembly.
BizLink’s Chairman, Roger Liang, said, "For the design of electronic products, the trend is for thinner, lighter, and aesthetically pleasing products whilst maintaining functionality and compatibility. This has prompted the demand for rapid and frequent updates of components and product styles. The ability to quickly develop products to respond to market changes has become the key to success."
Ventec International’s Chairman, Tony Lau, pointed out, "What the market needs is a platform that integrates the advantages of upstream components, mid-section design, and back-end manufacturing. The creation of such a platform, we knew, would greatly help accelerate industrial innovation." Footprintku Inc.’s Chairman, YC Hwang, continued, "In response, we propose a cloud platform using the exclusive AI and digital transformation technology of Footprintku.com to integrate the resources of all three companies. The result is a one-stop service, making it possible for product developers to quickly and efficiently find the best components and quality suppliers for their product R&D and design change stages."
This alliance is built upon Footprintku’s cloud database for electronic components as well as BizLink’s solutions and Ventec International’s materials. It integrates the capabilities of new product introduction (NPI), design services (ODM), and manufacturing assembly (EMS). This alliance will reduce the cost of and time in searching for electronic components for product developers. Furthermore, it will accelerate product evolution and facilitate industrial innovation by connecting highly flexible and customized electronic industry supply chain partners.
The alliance was officially announced at a press conference held at the Grand Hyatt Taipei on February 26, 2021.
Share on:
Suggested Items
Real Time with... IPC APEX EXPO 2025: Tariffs and Supply Chains in U.S. Electronics Manufacturing
04/01/2025 | Real Time with...IPC APEX EXPOChris Mitchell, VP of Global Government Relations for IPC, discusses IPC's concerns about tariffs on copper and their impact on U.S. electronics manufacturing. He emphasizes the complexity of supply chains and the need for policymakers to understand their effects.
The Chemical Connection: Surface Finishes for PCBs
03/31/2025 | Don Ball -- Column: The Chemical ConnectionWriting about surface finishes brings a feeling of nostalgia. You see, one of my first jobs in the industry was providing technical support for surface cleaning processes and finishes to enhance dry film adhesion to copper surfaces. I’d like to take this opportunity to revisit the basics, indulge in my nostalgia, and perhaps provide some insight into why we do things the way we do them in the here and now.
NUS Physicists Discover a Copper-free High-temperature Superconducting Oxide
03/28/2025 | PRNewswireProfessor Ariando and Dr Stephen Lin Er Chow from the National University of Singapore (NUS) Department of Physics have designed and synthesised a groundbreaking new material—a copper-free superconducting oxide—capable of superconducting at approximately 40 Kelvin (K), or about minus 233 degrees Celsius (deg C), under ambient pressure.
AT&S Sets New Standards in the Recycling of Copper and Chemicals
03/25/2025 | AT&SAT&S has been working for years to reduce the ecological footprint of its production sites worldwide with a comprehensive sustainability strategy and considerable investments.
Empowering the Future of Advanced Computing and Connectivity: DuPont Unveils Innovative Advanced Circuit Materials in Shanghai
03/24/2025 | DuPontDuPont will showcase how we are shaping the next generation of electronics at the International Electronic Circuits (Shanghai) Exhibition 2025.