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Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
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Virtual IPC APEX EXPO Kicks Off Today
March 8, 2021 | Barry Matties, I-Connect007Estimated reading time: 1 minute
There will be no long TSA lines, late flights, Uber rides, noisy hotel rooms, missing luggage, or aching feet...all things that we now long for. Instead, we will be attending our first-ever online IPC APEX EXPO 2021 starting today.
We have all had our fill of online meetings, events, conferences and social interactions, and we know it’s not the same as meeting in person. However, the online experience has taught us that we can still have meaningful experiences and exchange ideas to help us improve.
One key benefit with this year’s IPC APEX EXPO is your ability to choose what session you will see or not see, as the IPC will have the sessions available for 90 days after the show so that you can catch up on whatever you missed. Also, those on your team who normally do not travel to the event will now be able to take part.
So, today’s the day for your team to virtually travel to IPC APEX EXPO and enjoy a full schedule of events that will drive industry conversation and inspire our future. We here at I-Connect007 will bring you our complete Real Time with IPC event coverage, along with our special annual post-show Real Time with IPC Show & Tell Magazine. This publication will be packed with multimedia content, reviews, interviews and more.
We have also produced a special one-minute I-Connect007 video that can be viewed here:
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Rachael Temple - AlltematedSuggested Items
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.