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Drive Down Defects with True3D Technology from Koh Young
March 25, 2021 | Koh YoungEstimated reading time: 1 minute

Koh Young, the industry leader in True3D™ measurement-based inspection solutions will present a free smart inspection webinar on Wednesday, 31 March 2021 at 10:00AM CDT (GMT -5). The webinar will focus on how intelligent inspection solutions focused on pin and terminal inspection to increase productivity, improve quality, and reduce costs. Register today to secure your seat in the virtual event and understand how Koh Young solutions can help you to drive down defects in automotive and connector applications. Register today to secure your seat in the virtual event to learn from how to reduce costs and increase yields with Koh Young.
“Using our world-class True3D™ AOI technology, we designed the award-winning KY-P3 to overcome pin inspection challenges like high false call rates and escapes,” commented Gustavo Jimenez, Regional Sales Manager at Koh Young. “The KY-P3 provides an automated solution combining advanced high-resolution optics with innovative AI-powered algorithms for automated pin inspection. I look forward to discussing how we deliver unmatched capabilities that directly help automotive and connector assembly applications,” concluded Gustavo.
Incorporating the world’s first full 3D quad-projection probe, the system delivers shadow-free measurement of SMDs and pins up to 25mm tall. Additionally, the “Stop-and-Go” movement allows it to capture 3D measurement data without system vibration, image stitching, or data interpolation. The KY-P3s deliver reliable 3D measurement results with superior accuracy to boost your productivity and reduce costs.
Ideal for single pin, array, forked, press-fit, and more configurations, the KY-P3 quickly and accurately measures pin height, presence/absence, offset, shoulder height (absolute and relative), and coplanarity. It also measures the critical distance between features in absolute and relative terms, as well as inner/outer wall distances and pin separation. The system is even capable of solder paste height measurement and users are deploying it for Final Optical Inspection (FOI) of engine control units. Because the solution uses a measurement-based approach, the KY-P3 accuracy and repeatability are unsurpassed.
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Preventing Surface Prep Defects and Ensuring Reliability
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Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
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BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.