Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
American Made Advocacy: Where’s the Budget for a Modern Military Run on Microelectronics?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
DARPA Awards BAE Systems Two Awards under WARP Program
April 8, 2021 | BAE SystemsEstimated reading time: 1 minute
BAE Systems will design mechanisms for the U.S. Defense Advanced Research Projects Agency (DARPA) that protect emerging wideband receivers from interference, enabling their use in contested and congested environments. DARPA awarded two contracts to BAE Systems totaling $5 million under the Wideband Adaptive RF Protection (WARP) program which is designed to develop wideband adaptive filtering and signal cancellation architectures to safeguard emerging wideband receivers against both external and self-interference.
Within the Department of Defense, radio frequency (RF) systems must operate within an increasingly crowded electromagnetic spectrum and contend with mission-compromising interference from friendly and hostile sources.
“The ability to control signal strength across the electromagnetic spectrum is critical to the robust operation of wideband RF electronics,” said Chris Rappa, product line director at BAE Systems’ FAST Labs™ research and development organization. “WARP signal filters and cancellers will sense and adapt to the electromagnetic environment through the intelligent control of adaptive hardware.”
The technical areas of the program focus on enhancing electronic warfare technology to improve adaptive control of electromagnetic spectrum – enabling allied forces to freely operate while denying that advantage to adversaries. Specifically, Technical Area 1 is focused on mitigating external interference and Technical Area 2 is focused on mitigating self-interference from co-located transmitters to enable same-frequency simultaneous transmit and receive, also known as STAR.
The WARP awards add to the advanced defense electronics and electronic warfare research and development portfolio and are based on many years of investment on various programs including T-MUSIC, CONverged Collaborative Elements for RF Task Operations (CONCERTO) and Radio Frequency Field Programmable Gate Arrays (RF-FPGA).
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
IPS, SEL Raise the Bar for ENIG Automation in North America
09/11/2025 | Mike Brask, IPSIPS has installed a state-of-the-art automated ENIG plating line at Schweitzer Engineering Laboratories’ PCB facility in Moscow, Idaho. The 81-foot, fully enclosed line sets a new standard for automation, safety, and efficiency in North American PCB manufacturing and represents one of the largest fully enclosed final finish lines in operation.
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
09/09/2025 | Josh Casper -- Column: Smart AutomationLarge, irregular, or mechanically unique parts, often referred to as odd-form components, have never truly disappeared from electronics manufacturing. While many in the industry have been pursuing miniaturization, faster placement speeds, and higher-density PCBs, certain market sectors are moving in the opposite direction.
U.S. Army Begins Fielding BAE Systems’ Mission-critical Software-defined Radios Across Rotary-wing Aviation Fleet
09/08/2025 | BAE SystemsBAE Systems’ AN/ARC-231A Multi-mode Aviation Radio Set (MARS) has completed initial installation and is operationally ready for use today on select U.S. Army rotary-wing aircraft.