Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
It’s Only Common Sense: Your Biggest Competitor Is Complacency
The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
VARIOPRINT Converts to Peters Solder Resist
May 4, 2021 | Lackwerke Peters GmbH & Co. KGEstimated reading time: 2 minutes
In the course of a quality campaign, VARIOPRINT AG relies on the ELPEPCB® Elpemer® AS 2467 solder resist system. The Swiss company will use this solder resist in the future for a large part of their printed circuit board types. For this purpose, the Peters ink system has successfully passed all reliability tests, including those specified by the international standard IPC SM 840 E "Qualification and Performance Specification of Permanent Solder Masks." The reason for VARIOPRINT's campaign is advancing miniaturisation in the electronics industry which has led to more sophisticated PCB constructions and designs.
Leading PCB manufacturers such as VARIOPRINT are concerned with the risk of the PCB being damaged during soldering in assembly production owing to the higher temperature load. By choosing the solder resist system from Peters, the Swiss company located in the canton of Appenzell Ausserrhoden south of Lake Constance, can meet the requirements for production processes and materials. Particularly with regard to the base material, VARIOPRINT is able to provide, thanks to the Peters expertise, higher Tg values and a better dimensional stability of the PCBs. "Our process engineers defined very stringent specifications for the manufacturers, in view of guaranteeing the highest possible product quality to our customers in the future," says VARIOPRINT sales engineer Sascha Faust
VARIOPRINT is convinced that the new ink from Peters does not only feature a better environmental compatibility, but also a higher grain-fineness of pigments and fillers and a higher performance in exposure. The VARIOPRINT research team has established that the ELPEPCB® Elpemer® AS 2467 system made in Kempen ensures a better structuring of the ink on the PCB, especially in ultra-fine conductor applications. In addition, this creates a more homogeneous surface structure. Combined with modern production processes, the printed circuit board from VARIOPRINT coated with Peters ink is setting standards. Sascha Faust: "This is the only way to ensure that our PCBs will be of highest possible quality for the next PCB generation and the one after that."
Solder Resist is Eco-friendly
"The fact that VARIOPRINT, a globally recognised PCB producer, has opted for our solder resist is proof of confidence for us, and an incentive to offer ourselves to other manufacturers," says Daniel Langenstein, managing director of Peters Schweiz GmbH, referring to other companies of the industry that have recently switched over to this or similar Peters products for the reason of their quality advantage and the eco seal. This is because the eco-friendly products from the Lower Rhine do not contain the problematic photoinitiators type 907 or 369 that the authorities have classified as a hazard to health and environment.
"The fact that VARIOPRINT, a globally recognised PCB producer, has opted for our solder resist is proof of confidence for us, and an incentive to offer ourselves to other manufacturers," says Daniel Langenstein, managing director of Peters Schweiz GmbH, referring to other companies of the industry that have recently switched over to this or similar Peters products for the reason of their quality advantage and the eco seal. This is because the eco-friendly products from the Lower Rhine do not contain the problematic photoinitiators type 907 or 369 that the authorities have classified as a hazard to health and environment.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in