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IPC Commends Biden Administration on 100-Day Review of Strategic Supply Chains
June 9, 2021 | IPCEstimated reading time: 2 minutes
IPC commends the Biden administration for completing its 100-day review of strategically important supply chains and for outlining bold actions to strengthen U.S. semiconductor manufacturing and ensure the availability of minerals critical to electronics manufacturing.
The results of the 100-day review are captured in an 11-page White House fact sheet and a 250-page report, released today. IPC believes the review has been helpful in bringing key issues into focus, including the importance of strengthening the entire electronics manufacturing ecosystem. The entire supply chain includes printed circuit board (PCB) and PCB assembly manufacturing; access to raw materials; and next-generation “advanced packaging” of substrate-based multichip modules.
IPC’s recommendations to the administration – many of which are reflected in the documents published today – are summarized in a recent letter to U.S. Commerce Secretary Gina Raimondo.
“For far too long, the U.S. Government has neglected its important role in strengthening the nation’s manufacturing base and instead has watched passively as other countries around the world invested in their manufacturing capabilities,” said IPC CEO John Mitchell. “U.S. electronics manufacturers appreciate the Biden administration’s decision to highlight the longstanding and significant challenges facing the U.S. electronics manufacturing base as a result.”
“This report outlines important, initial steps to address the current crisis and reaffirms the President’s commitment to preserve and extend U.S. leadership in innovation and advanced manufacturing. But addressing America’s manufacturing capacity decline will be a long process,” Mitchell added. “We look forward to working with the Executive Branch, Congress, and an array of stakeholders to reverse the erosion of the U.S. electronics industrial base and related risks to economic and national security.”
IPC and the electronics manufacturers it represents support the following actions being taken or proposed by the Biden administration:
- Address semiconductor shortages by expanding U.S. production of chips; creating a task force to address supply chain challenges in several electronics-dependent sectors; and investing in domestic “advanced packaging” capabilities, of which printed circuit boards (PCBs) and PCB assembly manufacturers are critical components.
- Adjust federal acquisition policies to identify and support procurement of critical products like PCBs and printed circuit board assemblies.
- Bolster investment in domestic and international production of critical minerals, most notably though the Defense Production Act.
- Strengthen U.S. apprenticeships programs to ensure a skilled workforce.
- Promote international cooperation to support supply chain resiliency, which will be critical because no nation in today’s world can be completely self-sufficient in electronics and manufacturing.
- Ensure a level playing field by addressing long-standing trade disputes.
In addition, IPC supports other efforts outlined by the Biden administration as part of this announcement to strengthen the U.S. industrial base, including:
- Appropriation of $50 billion in dedicated funding for semiconductor manufacturing and R&D;
- Establishment of a new Commerce Department Supply Chain Resilience Program, backed by no less than $50 billion in federal funding;
- Funding under the Defense Production Act to support manufacturing resilience in critical industries;
- Creation of sector-specific workforce education and training programs; and
- Support of the R&D and capital needs of small- and medium-sized businesses that that are the foundation of the U.S. electronics manufacturing base.
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Julia McCaffrey - NCAB GroupSuggested Items
EIPC Technical Snapshot: Sustainability in Electronics Manufacturing
11/06/2025 | Pete Starkey, I-Connect007EIPC selected the highly topical issue of sustainability in electronics manufacturing for the 24th Technical Snapshot webinar on Oct. 29, with guest speakers Satoshi Konagai of Elephantech and Liisa Hakola of the VTT Technical Research Centre of Finland. The program was moderated by Kirsten Smit-Westenberg, executive director of EIPC, who also introduced each speaker.
Target Condition: Distribution of Power—Denounce the Ounce
11/05/2025 | Kelly Dack -- Column: Target ConditionHave you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.
Life Is a Highway: A Family of 8 Turned the Entire U.S. Into a Learning and Working Environment
11/04/2025 | Steven Bowles, Lockheed MartinIt’s 6:45 a.m. in a modern A-frame cabin tucked into the misty edges of the Cascade Range in Arlington, Washington. I’ve just made a quick Nespresso, checked my calendar of virtual meetings, and verified the Airbnb’s Wi-Fi speed is holding steady. In the next room, my wife Lynsey corrals our six kids into breakfast while planning a day trip to Seattle’s Children’s Museum. By 7:30, I’m camera-ready in a makeshift office nook, leading a discussion on HDI PCB design for an IPC standards committee. After a busy day, our Bowles crew, ranging in age from 1 to 10 years old, is hands-on with activities and exhibits in the museum.
TTM Technologies Receives Two Awards from the Global Electronics Association at the 2025 IPC CEMAC Conference
11/03/2025 | Globe NewswireTTM Technologies, Inc. announced that two of its team members received prestigious Asia Steering Committee Outstanding Service Awards from the Global Electronics Association (formerly named IPC connecting global electronics industry) at the 2025 IPC CEMAC Electronics Manufacturing Annual Conference in Shanghai.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.