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Flexible Circuit Technologies to Host Free Flex Heater Webinar
August 18, 2025 | Flexible Circuit TechnologiesEstimated reading time: 1 minute
Global supplier of flexible circuits, flex design services, and assembly/box-build services, Flexible Circuit Technology will host their latest webinar, "Thermal Precision Meets Flexibility: The Technology Behind Heater Circuits" on Tuesday, August 26th, 2025 at 11 AM EDT.
This flexible heater webinar will provide valuable insight into the 'why or why not' use of the latest innovations and practical applications of flexible heaters. Participants gain a deeper understanding of how flexible heaters are engineered, customized, and integrated into products across various industries including automotive, medical, aircraft, and consumer electronics. We will highlight real-world case studies and design considerations, helping attendees learn how to optimize performance, improve energy efficiency, and solve specific heating challenges in complex environments.
WEBINAR: August 26, 2025, 11 AM EDT (10 AM CST)
KEY TAKEAWAYS:
- Discover the benefits of flexible heaters for a variety of applications
- Explore the advantages and limitations of flexible heaters
- Understand design considerations for maximizing performance and durability
- Compare the merits of adhesive and resistive foil selections
- Examine the cost drivers of flexible heaters
SPEAKERS:
Mark Finstad, Director of Application Engineering, Flexible Circuit Technologies
Mark Finstad is an internationally recognized flexible circuit expert in design, fabrication and testing of flexible and rigid flex circuits offering more than 40 years of industry expertise. He is vice-chair of the IPC Flexible Circuits Committee, member of IPC Technical Activities Executive Committee (TAEC), Chairman of IPC-2223 Flexible Circuit Design Committee, and is an active member on the IPC-6013, IPC-4202, IPC-4203, and IPC-4204 committees. Finstad is a senior instructor on Flexible PCB design at IPC and PCB Design conferences. He is also an established columnist for Printed Circuit Design and Fab magazines and a featured writer for SMT, Connector Specifier, Machine Design, Medial Design and more.
Chris Clark, Senior Applications Engineer, Flexible Circuit Technologies
Chris Clark has more than 30 years of expertise to his customers as another of our highly experienced senior applications engineers. The breadth of his experience includes flex and rigid flex design, process engineering, project management, manufacturing and design for manufacturability. This broad range of experience allows Clark to take a design from concept to creation while avoiding pitfalls along the way. He also is a member of the IPC-2223, 6013, 4202 and 4204 committees.
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Simon Khesin - Schmoll MaschinenSuggested Items
Global Market for Flexible Manufacturing Systems Set to Surge to $22.2 Billion by 2030
03/02/2026 | GlobeNewswireAccording to the latest study from BCC Research, “Global Market for Flexible Manufacturing Systems” is expected to increase from $15.2 billion in 2025 to $22.2 billion by the end of 2030, at a compound annual growth rate (CAGR) of 7.9% from 2025 through 2030.
SEMI FlexTech Names 2026 FLEXI Award Winners in Flexible Electronics
02/27/2026 | SEMIRecognizing innovations and other outstanding accomplishments in flexible hybrid electronics (FHE), FlexTech, a SEMI Technology Community, announced winners of the 2026 FLEXI Awards presented at the FLEX Conference on February 25 at the Wigwam Resort in Phoenix, Arizona.
Amphenol Printed Circuits Shows PCBs for Quantum Computing at 2026 APS
02/26/2026 | Amphenol Printed CircuitsGlobal leader in printed circuit boards (PCBs) and interconnects, Amphenol Printed Circuits (APC), will be attending and exhibiting at the American Physical Society’s APS Global Physics Summit 2026, March 15-20, 2026 in Denver, CO.
Flexible Printed Circuit Board Market to Reach $45.42 Billion by 2030, Growing at 10% CAGR
02/20/2026 | Globe NewswireThe flexible printed circuit board (FPCB) market has been expanding robustly. Expected to grow from $28.36 billion in 2025 to $31.07 billion in 2026 at a CAGR of 9.5%, the market's historic growth is due to advancements in mobile device manufacturing, early adoption of flexible electronics, demand for lightweight circuit solutions, and telecom infrastructure expansion.
The Chemical Connection: Changes and Challenges Ahead in PCB Fabrication
02/09/2026 | Don Ball -- Column: The Chemical ConnectionWhat are the most influential changes in PCB fabrication in the next five years? Throughout my many years in the PCB industry, I have witnessed numerous predictions about the industry's future, as well as the introduction of alternative processes that promised to revolutionize the industry. Most of the more radical predictions have fallen by the wayside, and those alternative processes have failed to produce the predicted results, becoming niche processes at best.