-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Nordson Electronics Solutions Introduces MARCH MegaVIA Plasma Treatment System
June 30, 2021 | Nordson Electronics SolutionsEstimated reading time: 1 minute
Nordson Electronics Solutions, a division of Nordson Corporation, a global leader in plasma processing technology, introduces the MARCH MegaVIA™ Plasma Treatment System with a 15-cell configuration for panel sizes up to 30 x 52 inches in printed circuit board manufacturing. With overall dimensions of 1652mm W x 1782mm D x 2326mm H, the new MegaVIA™ system offers increased panel loading by more than 54% with only a 2% increase in footprint when compared to a MARCH MaxVIA™-Plus. The new platform delivers high process reproducibility and plasma treatment uniformity for PCB panels.
“Nordson has set the global standard for plasma treatment in the PCB market for more than 35 years with its industry-leading MARCH VIA platform,” explained Al Bousetta, director of marketing, MARCH Products. “The new MegaVIA™ plasma system builds on the success of earlier platforms with increased process capacity for large panels and minimum use of valuable production floor space. As with other VIA series products, the system provides uniform plasma treatment results to meet rigorous PCB manufacturing requirements.”
The MegaVIA™ system provides plasma treatment at 40 kHz and accommodates all common gases -- CF4, oxygen, nitrogen, and argon -- with high process reproducibility and uniformity. An EPC controller with intuitive Windows® 10 PC-based touch screen HMI allows for a wide range of data collection and control capabilities.
Plasma treatment uniformity is critical for a large chamber system. Higher than 80% uniformity for desmear and etch back applications to both sides of the PCB panels is achieved using the MegaVIA™ system’s power-power electrode configuration, balanced vacuum and gas flow, and temperature management technologies.
Suggested Items
Market-Comms, VNU Asia Pacific Unite to Drive THECA 2025 as a PCB Industry Game-Changer
12/23/2024 | EINPresswire.comThailand Electronics Circuit Asia (THECA) 2025 has officially announced its event partnership with Market-Comms Co., Ltd. (MCOMMS), No.1 local public relations firm, and VNU Asia Pacific, the designated show manager for the event.
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
Flexible Printed Circuit Boards Market Expected to Reach $51.05 Billion by 2031 at a CAGR of 11.2%
12/20/2024 | EINPresswire.comA new report by Coherent Market Insights forecasts the global flexible printed circuit boards (FPCB) market to reach $51.05 billion by 2031, reflecting a strong compound annual growth rate (CAGR) of 11.2% from 2024.
The ICAPE Group Expands Its Activities in the United Kingdom With the Acquisition of ALR Services Ltd.
12/20/2024 | BUSINESS WIREThe ICAPE Group, a global technology distributor of printed circuit boards (PCB) and custom-made electromechanical parts, today announced the acquisition of 100% of the capital of ALR Services Ltd, a British PCB distributor.
Spotlight on PEDC: Filbert Arzola
12/19/2024 | Andy Shaughnessy, Design007 MagazineIPC and FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30 at the NH Danube City hotel in Vienna. Raytheon’s Filbert Arzola is presenting “Engineering and Adapting Model-based PCB Design in Step with Sustainability and Digital Twins” at PEDC. I asked Filbert to discuss what attendees can expect from his class.