-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
The Automation Advantage
In this issue, we discover how AI, machine learning, and practical factory automation are reshaping PCB fabrication, and where these tools can meaningfully move your business forward.
Thank you, Columnists
This month, we give thanks to our columnists—the brilliant minds who share their expertise, experiences, and passion for the PCB industry. Meet the people behind the pages, learn what drives them, and discover their personal stories.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Zhen Ding Promotes Digital Transformation and Embraces AI Business Opportunities
June 6, 2025 | Zhen Ding TechnologyEstimated reading time: 3 minutes
On May 27, 2025, General Manager Chen-Fu Chien of Zhen Ding Technology Group was invited to attend the "2025 Two Thousand Forum" held by The CommonWealth Magazine. He delivered a speech on "PCB Industry Development and Global Layout", sharing forward-looking insights on vertical integration of PCB industry and semiconductor industry, as well as the development blueprint of Zhen Ding Technology Group.
Semiconductor driven PCB industry innovation co-prosperity
With the continuous evolution of Moore's Law, the PCB industry and the semiconductor industry are closely symbiotic. On the one hand, semiconductor technology continues to challenge physical limits. On the other hand, the development of More Moore and More than Moore has put forward higher requirements for PCB performance and smart manufacturing technology. Zhen Ding Technology Group is actively driving its transformation from excellence to outstanding performance, such as IC substrate technology and high-density circuit design, to support the continuous miniaturization of chips and ensure efficient data transmission and processing. Over the past 20 years, the body size of the substrate has increased by about 20 times, the number of layer count has more than quadrupled, and the number of bump count has increased by over 300 times, resulting in a comprehensive benefit improvement of over 24,000 times. This growth aligns with the pace of improvement seen in Moores Law, supporting the development of the semiconductor industry. Charles Shen , chairman of Zhen Ding Technology Group, has mastered the trend and proposed the One ZDT strategy, actively deployed the cloud network and provided a comprehensive solution. This year, AI products accounted for more than 70%.
Zhen Ding Technology Group enables smart factories to serve global customers
Zhen Ding Technology Group has been ranked first in the world for eight consecutive years, with a market share of 7.3%, indicating significant growth potential in the PCB industry. The company, similar to the semiconductor industry, operates 29 factories worldwide and employs approximately 50,000 staff, forming a robust production and service network. Zhen Ding Technology Group is actively promoting AI-driven smart manufacturing and digital transformation, enhancing industrial engineering and lean management to boost organizational efficiency. Through the digitalization of operations, the platformization of data, the intelligence of platforms, and the practical application of intelligence, the company is fully implementing Industry 4.0 smart factories in new plants and driving the Industry 3.5 upgrade in existing plants. By integrating and enhancing systems such as manufacturing execution systems, supply chain management systems, and introduce advanced quality management and intelligent equipment management systems to collect large data in the production process, and establish a computing power platform to optimize production processes and intelligent decisions to improve quality, delivery time, yield and supply chain services. In order to serve customers, Zhen Ding Technology Group has a global layout. On May 8, the first factory in Thailand started construction and the second factory started ground; In Kaohsiung, Zhen Ding Technology Group has established the Zhen Ding AI Park, becoming the first PCB company to enter a science park, and continues to invest in China to promote corporate social responsibility and sustainable development.
In response to the host's question about how to face future challenges, General Manager Chen-Fu Chien said that industrial reform and organizational change are talent-oriented. Drawing from his personal experience, he explained that to align with Chairman Charles Shen vision of transforming the company from good to great, he left the comfort zone to join Zhen Ding Technology Group. Chairman Shen has consistently recruited outstanding talents from various fields. Zhen Ding Technology Group adheres to long-term principles and attaches great importance to continuous investment in R&D. Last year, its revenue was approximately TWD 171.7 billion, and its R&D investment was TWD 11.7 billion, accounting for nearly 7% of revenue. Last year's net profit was TWD 13.1 billion, depreciation was nearly TWD 17.7 billion, and cash exceeded TWD 80 billion yuan, The financial stability and sufficient resources can support the group's continued investment growth and will gradually show concrete results and explosive growth in the future .
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
SEMI Reports 2025 Annual Worldwide Silicon Wafer Shipments and Revenue Results
02/11/2026 | PRNewswireWorldwide silicon wafer shipments in 2025 increased 5.8% to 12,973 million square inches (MSI) while wafer revenue slipped 1.2% to $11.4 billion over the same period, the SEMI Silicon Manufacturers Group (SMG) reported in its year-end analysis of the silicon wafer industry.
New Research Group: AT&S Strengthens Microelectronics at TU Graz
02/11/2026 | AT&SAT&S is setting another strategic milestone for the technological future of Europe and is funding the establishment of a new research group at Graz University of Technology (TU Graz) in the field of microelectronics with a focus on IC substrates and advanced packaging technologies.
Smart City Technologies Gain Global Momentum Across Core Urban Services
02/11/2026 | Berg InsightBerg Insight,released the latest edition of its comprehensive smart city technology report comprising in-depth studies of five key technology areas – smart street lighting, smart parking, smart waste collection, urban air quality monitoring and smart city surveillance.
Powering the Future: From Thick-Film to DBC—Understanding the Evolution of Ceramic Packaging
02/11/2026 | Brian Buyea -- Column: Powering the FutureCeramic packaging has quietly powered the electronics revolution for more than half a century. From the earliest thick-film hybrids to today’s direct bond copper (DBC) substrates and metallized aluminum nitride, every step forward in ceramic technology has pushed the limits of reliability, power density, and performance. It’s essential for every design engineer building the next generation of electronic systems to understand this evolution.
Zhen Ding Reports January 2026 Monthly Revenue
02/09/2026 | Zhen Ding TechnologyZhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported January 2026 revenue of NT$13,564 million, up 0.71% YoY, marking a record high for the same period in the company’s history.