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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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IPC Welcomes U.S. Senate Vote on Infrastructure Bill but Questions Superfund Tax
August 5, 2021 | IPCEstimated reading time: 1 minute
IPC issued the following statement by its President and CEO, John Mitchell, on the bipartisan infrastructure bill approaching a vote this week in the U.S. Senate:
“Electronics manufacturers welcome the prospect of historic infrastructure investments in America’s roads, ports, electric grids, and digital networks. Our members’ supply chains depend on modern, resilient infrastructure; and in today’s high-tech world, America’s infrastructure depends on reliable electronics. We also appreciate the inclusion of smart manufacturing investments. This bipartisan infrastructure bill will help drive growth in the overall economic recovery, as well as in our specific industry.
“We commend the tireless efforts of Senators Rob Portman and Kyrsten Sinema, along with the bipartisan Group of 22, which labored arduously to produce this compromise.
“Although this critical legislation addresses the nation’s much-needed infrastructure modernization, IPC is concerned that reinstating Superfund excise taxes on 42 chemicals and raw materials – some of which are building blocks of electronics manufacturing – will increase costs for U.S. electronics manufacturers and raise prices for many consumer goods, including many of the materials that will be utilized in America’s infrastructure investment. IPC calls on Congress to find other, more appropriate methods to pay for this necessary investment in America’s aging infrastructure.”
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Brent Fischthal - Koh YoungSuggested Items
IPC CFX Demo Line Debuts in Korea at EMK 2026
04/10/2026 | Global Electronics AssociationAt Electronics Manufacturing Korea (EMK) x NEPCON Korea 2026, the Global Electronics Association, in collaboration with 13 companies, showcased the IPC CFX Demo Line (Connected Factory Exchange demonstration line), marking its debut in Korea.
IPC-7712 Development Advances at APEX EXPO: Committee Aligns on Scope, Structure, and Industry Priorities
04/10/2026 | Circuit Technology Center, Inc.Significant progress was made in developing the proposed standard IPC-7712, Component Safe Removal for Failure Analysis and Reclamation, during in-person meetings held at APEX EXPO, March 16 to 18.
2026 IPC Masters Competition China Wraps Up With Record Participation
04/07/2026 | Blair Yan, Global Electronics Association East AsiaThe three-day 2026 IPC Masters Competition concluded March 27 at productronica China in Shanghai, bringing together the largest and most highly skilled group of electronics assembly professionals in the event’s 16-year history. With 623 participants from 77 companies across China—up 30% from last year—the competition reflected a growing focus on the practical application of electronics manufacturing standards.
IPC Masters Competition China 2026 Unveils Winners, Empowering Advanced Talent Development in Electronics Manufacturing
04/01/2026 | Global Electronics AssociationOn March 25–27, the IPC Masters Competition China was held in Pudong, Shanghai. This year’s competition brought together 623 leading professionals in the electronics industry from 21 provinces and municipalities.
Global Electronics Association, MIMOS Berhad Sign MoU to Advance Malaysia’s Electronics and Semiconductor Ecosystem
03/31/2026 | Global Electronics AssociationThe Global Electronics Association and MIMOS Berhad recently signed a Memorandum of Understanding (MoU) to collaborate in strengthening Malaysia’s electronics and semiconductor ecosystem, with a focus on advanced electronic packaging (AEP), industry alignment, and global best practices.