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IPC Welcomes U.S. Senate Vote on Infrastructure Bill but Questions Superfund Tax
August 5, 2021 | IPCEstimated reading time: 1 minute

IPC issued the following statement by its President and CEO, John Mitchell, on the bipartisan infrastructure bill approaching a vote this week in the U.S. Senate:
“Electronics manufacturers welcome the prospect of historic infrastructure investments in America’s roads, ports, electric grids, and digital networks. Our members’ supply chains depend on modern, resilient infrastructure; and in today’s high-tech world, America’s infrastructure depends on reliable electronics. We also appreciate the inclusion of smart manufacturing investments. This bipartisan infrastructure bill will help drive growth in the overall economic recovery, as well as in our specific industry.
“We commend the tireless efforts of Senators Rob Portman and Kyrsten Sinema, along with the bipartisan Group of 22, which labored arduously to produce this compromise.
“Although this critical legislation addresses the nation’s much-needed infrastructure modernization, IPC is concerned that reinstating Superfund excise taxes on 42 chemicals and raw materials – some of which are building blocks of electronics manufacturing – will increase costs for U.S. electronics manufacturers and raise prices for many consumer goods, including many of the materials that will be utilized in America’s infrastructure investment. IPC calls on Congress to find other, more appropriate methods to pay for this necessary investment in America’s aging infrastructure.”
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Sweeney Ng - CEE PCBSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
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North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
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10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.