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Disruptive Technologies Expert David Pogue to Keynote IPC APEX EXPO 2022
October 6, 2021 | IPCEstimated reading time: 1 minute
Each year, IPC APEX EXPO features industry’s most dynamic, innovative minds to deliver keynote presentations that are both educational and entertaining. IPC APEX EXPO 2022 will feature New York Times Columnist, Emmy-Winning CBS Sunday Morning Contributor & NOVA Host David Pogue. During his keynote on January 25, Pogue will present, “Disruptive Tech: How it Will Affect Your Business and What’s Coming by 2026.”
Drones and robotics, AI, self-driving cars, employee-less stores, flying taxis, wearable medical sensors, software, and components are accelerating the arrival of new consumer technologies—and with them, changes to society and culture. With 30 years of experience reporting technology trends—and the entertaining style that has earned him six Emmys for his “CBS Sunday Morning” stories— Pogue will take keynote attendees on a wild ride through the cutting-edge science and technology that is powering a next wave of technological innovation. His funny, fast-paced snapshot will bring everyone up to date – with a heads-up on how to succeed in a world we’ve never seen before.
“With broad appeal to general, business, healthcare, and tech audiences alike, David will bring his expansive knowledge, engaging wit, and perhaps a song or two to the APEX EXPO keynote stage,” said Alicia Balonek, IPC senior director of trade shows and events. “The audiences will leave as informed as they are entertained, with an enlightened perspective of the state of technology today — and how it’s shaping everyone’s tomorrow.”
Pogue’s keynote is free to all IPC APEX EXPO participants. In addition to Pogue’s keynote, John Mitchell, IPC president and CEO will deliver a keynote on Wednesday, January 26. Meetings and courses will run January 22-27; the technical conference and exhibition will run January 25-27, 2022. For more information on schedule and registration options, visit www.IPCAPEXEXPO.org.
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"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.