Vodafone, Qualcomm Technologies, Thales Deliver World-First Smartphone Demonstration of iSIM Technology
January 18, 2022 | Qualcomm Technologies, Inc.Estimated reading time: 3 minutes
Leading industry innovators Vodafone, Qualcomm Technologies, Inc., and Thales have joined forces to demonstrate a working smartphone featuring iSIM (based on the ieUICC[1] GSMA specification) - a new technology enabling the functionality of a SIM card to be integrated into a device’s main processor. This milestone paves the way for commercialisation of the technology, which could be rolled out in a host of new devices that will use iSIM to connect to mobile services.
The iSIM, which complies with GSMA specifications, embeds the SIM functionality into the device’s main processor, allowing for greater system integration, higher performance, and increased memory capacity. This technology is the latest evolution of SIM technology in which ‘eSIMs’ are embedded into devices. However, eSIM requires a separate chip: with iSIM this is no longer necessary and removes the need for dedicated space assigned to SIM services.
iSIM technology is a significant evolution on existing eSIM solutions and delivers wholesale benefits to both consumers and telecommunications operators, further paving the way for mobile services to be integrated into devices beyond the mobile phone, taking the mobile experience to laptops, tablets virtual reality platforms, IoT devices, wearables, and more. The iSIM is integrated in the application processor of the device bringing multiple benefits:
- Simplifies and enhances device design and performance by releasing space previously occupied within a device
- Consolidates the SIM functionality into the device’s main chipset alongside other critical capabilities such as GPU, CPU, and modem
- Enables remote SIM provisioning by the operator leveraging the existing eSIM infrastructure
- Opens mobile service connection capabilities to a host of devices that previously could not have SIM capabilities built-in
A proof of concept (POC) demonstration took place in Europe, as one of the highest global smartphone penetration regions. The POC illustrates the technology’s commercial readiness and efficiency working on existing infrastructure, leveraging Vodafone’s advanced network capabilities. In the demonstration, the fully operational proof of concept device used on Vodafone’s network was based on the Samsung Galaxy Z Flip3 5G powered by a Snapdragon® 888 5G Mobile Platform, which features a built-in Qualcomm® Secure Processing Unit running the Thales iSIM operating system for the purpose of this demonstration. This proof of concept took place in Samsung’s R&D labs using Vodafone’s advanced remote management platform.
Alex Froment-Curtil, chief commercial officer, Vodafone, said: “Our aim is to create a world where every device connects seamlessly and simply to each other, and the customer has complete control. The iSIM, combined with our remote management platform, is a major step in this direction, allowing devices to be connected without a physical SIM or dedicated chip, making connectivity to many objects – the promise of the connected IoT world – a reality. It will enable our customers to enjoy the ease of multiple accounts on one device, while from an operator’s point of view, help eliminate the need for separate SIM cards and the additional plastic this consumes. We will continue working closely with Qualcomm Technologies and Thales to evolve further applications for this technology and accelerate its commercialisation.”
Enrico Salvatori, senior vice president and president, Europe/MEA, Qualcomm Europe, Inc., said: “iSIM solutions offer great opportunities to MNOs, free-up valuable space in devices for OEMs, and provide flexibility for device users to benefit from the full potential of 5G networks and experiences across a wide range of device categories. Some of the areas that will benefit most from iSIM technology include smartphones, mobile PCs, VR/XR headsets, and industrial IoT. By engineering the iSIM technology into the SoC, we are able to create additional support for OEMs in our Snapdragon platform.”
Emmanuel Unguran, senior vice president mobile connectivity solutions at Thales, said: “With new types of networks and devices rolling out, innovation in SIM technology is essential to best serve the connected world. The iSIM supports new device design and manufacture while providing the same digital experience as the eSIM, and certified security levels. Thales is committed to on-going innovating with our partners to provide the best connectivity experience.”
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.