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Infineon, NIELIT Partner to Strengthen India’s Semiconductor Talent

01/14/2026 | PRNewswire
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Upcoming Issue: Design, Integration, and the Global Push for Advanced Packaging

01/14/2026 | I-Connect007
The upcoming Jan. 19 issue of Advanced Electronics Packaging Digest examines how advanced packaging is redefining system integration, regional semiconductor strategy, and the materials and technologies shaping next-generation electronics. From interposer design challenges to global collaboration and substrate innovation, this issue offers timely insight into where the industry is headed in 2026 and beyond.

Micron Announces Groundbreaking for Historic New York Megafab

01/13/2026 | Micron
Micron Technology, Inc. announced that on Jan. 16, 2026, it will officially break ground on its megafab in Onondaga County, New York.

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TSMC and Samsung are cutting 8-inch wafer capacity, pushing global 8-inch capacity to a projected 2.4% year-over-year decline in 2026.

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