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Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
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I-Connect007 Editor's Choice: Five Must-Reads for the Week
February 25, 2022 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes
Like many of you, for the past few months, we’ve been busier than a farmer with two rattlesnakes and one shovel. As soon as we got home from IPC APEX EXPO 2022 we started work on our post-show publication, Real Time with… IPC APEX EXPO 2022 Show & Tell Magazine. Now in its fifth year, Show & Tell is the best—and most exhaustive—source of in-depth information about IPC APEX EXPO.
We published Show & Tell this week, and the response from industry leaders has been off the charts. Show & Tell gives the reader a taste of what it was like to be at the show, from ribbon-cutting and keynotes through the last conference classes. If you haven’t read Show & Tell yet, check it out.
IPC APEX EXPO 2022 Show & Tell Magazine Available Now
Published February 24
This week, we welcomed our new baby into the world. And Real Time with… IPC APEX EXPO 2022 Show & Tell Magazine is a big one; don’t get me started on the labor pains! We bring you 184 pages of coverage from San Diego, featuring interviews with executives and engineers, managers and machine operators, as well as the young and not so young. If you didn’t make it to IPC APEX EXPO 2022, check out Show & Tell Magazine and find out how the industry celebrated what was, for many, the first trade show in two years.
AltiumLive 2022: Power and Signal Integrity—Return to Sender
Published February 23
Which came first: the chicken of the egg? In this interview, Keysight Technologies’ Heidi Barnes and Stephen Slater pose a similar question. Which came first: signal integrity or power integrity? The two engineers discuss their AltiumLive presentations, now available online, which offer tips and techniques for avoiding SI and PI issues down the road, and why a clear return path is paramount to a successful high-speed design.
Real Time with... IPC APEX EXPO 2022: The Challenges With Lead Times
Published February 22
One of the hottest topics at IPC APEX EXPO was the supply chain. It was inspiring to see how so many electronics companies have figured out how to get around the problem of 50-week lead times. In this interview, Manncorp’s Ed Stone and Guest Editor Kelly Dack discuss Manncorp’s various supply chain strategies, including bringing production in-house.
Fein-Lines: Here’s How Technology Will Play Out in 2022
Published February 21
Much of our industry revolves around the requirements of the consumer electronics segment, and our columnist Dan Feinberg is also our go-to guy for consumer electronics information. In his latest column, Dan shares his predictions and recommendations for consumer electronics during the remainder of 2022, including some tips about the new Windows 11.
Alex Stepinski: Taking Control of Input Costs
Published February 23
Many people associate Alex Stephinski with greenfield sites because of his smart factory efforts over the past few years. But he has a thing or two to share with the industry about tightening up input costs at your brownfield site as well. In the February issue of PCB007 Magazine, Alex explains a few strategies for making the most of your existing facility. Spoiler alert: There’s no silver bullet here. Teasing out value from your current facility is a slow, methodical, step-by-step process.
Suggested Items
NEOTech Significantly Improves Wire Bond Pull Test Process
11/25/2024 | NEOTechNEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%.
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence
11/19/2024 | IPCIPC, a leading global electronics industry association and source for industry standards, training and advocacy, is proud to announce its participation in National Apprenticeship Week, scheduled for November 17-23, 2024.
IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.