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Automotive Initiatives Make Headway at IPC APEX EXPO
February 25, 2022 | Tracy Riggan, IPCEstimated reading time: 1 minute
A significant number of automotive activities made notable strides at this year’s IPC APEX EXPO. Several committees dedicated to creating and updating automotive addenda for existing IPC standards, like assembly processes, PCB fabrication, and high-voltage cable, met and were led by companies like Toyota, Bosch, Continental, and Elmatica. Automotive dedicated groups, like the Cold Joining/Press-fit Task Group, also met and discussed inclusions in its next planned revision. As part of the IPC-6012 Automotive Addendum Task Group meeting, the group brainstormed high voltage considerations in the next revision or as separate standards, building on discussions that took place during task group meetings in conjunction with productronica 2021.
Additionally, automotive was a component of educational programming, with several courses and technical papers presented throughout the week. The Press-fit Technology Deep Dive course outlined key design processes and how to use the standard for process, quality, and design/development engineers for manufacturers and OEMs who use electronic components. Vern Solberg, Solberg Technical Consulting, conducted a course on PCB design which addressed flexible and rigid-flex applications and design principles for automotive use environments. Automotive leaders also took the stage on innovative technology, electrical test methods, and artificial intelligence in the SMT inspection process.
The IPC Transportation Electronics Council (ITERC) met to review global industry survey results and discuss necessary next steps for assuring automotive electronics reliability. The council, comprised of automotive OEMs and key automotive suppliers, engaged in thoughtful discussion about standardization and industry needs. The group generated a dynamic list of action items.
This article originally appeared in Real Time with...IPC APEX EXPO 2022 Show & Tell Magazine.
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DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
Elementary Mr. Watson: Retro Routers vs. Modern Boards—The Silent Struggle on Your Screen
06/26/2025 | John Watson -- Column: Elementary, Mr. WatsonThere's a story about a young woman preparing a holiday ham. Before putting it in the pan, she cuts off the ends. When asked why, she shrugs and says, "That's how my mom always did it." She asks her mother, who gives the same answer. Eventually, the question reaches Grandma, who laughs and says, "Oh, I only cut the ends off because my pan was too small." This story is a powerful analogy for how many PCB designers approach routing today.
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Beyond Design: The Metamorphosis of the PCB Router
06/18/2025 | Barry Olney -- Column: Beyond DesignThe traditional PCB design process is often time-consuming and labor-intensive. Routing a complex PCB layout can consume up to 30% of a designer’s time, and addressing this issue is not straightforward. We have all encountered this scenario: You spend hours setting the constraints and finally hit the Go button, only to be surprised by the lack of visual appeal and the obvious flaws in the result.