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Excellon Installs COBRA-II Hybrid Laser System at TCLAD, Inc.
March 8, 2022 | ExcellonEstimated reading time: 1 minute
Excellon announces the installation of a COBRA-II Hybrid Laser System by TCLAD, Inc. of Prescott, Wisconsin. The Excellon COBRA-II Hybrid Laser System offers both UV and CO2 (IR) laser sources on a single platform. A large work area offers added capability for those companies running high-density prototypes and production PCBs.
Acquiring the Excellon COBRA-II laser adds yet another addition to our lineup of state-of-the-art circuit processing equipment at our Prescott Wisconsin facility. Over the years we have found the accuracy and speed of the Excellon COBRA lasers to be impressive, the new COBRA-II laser is no exception. We are seeing greatly reduced throughput time with excellent tolerance capability. This allowed us to reduce lead times and better meet the demanding dimensional challenges of our customer requirements. (Steve Taylor, Director of Technical Support, Global BDM)
TCLAD Inc., a Polytronics related company, formerly BERGQUIST Thermal Clad Division, Located in Prescott, Wisconsin, since 1997. For over 50 years, Bergquist products have been the world’s most trusted thermal management materials. Multi-award-winning formulations in various mediums provide essential heat dissipation for applications within numerous markets including automotive, consumer, telecom/datacom, power and industrial automation, computing, communication and many others.
Mike Sparidaens, Vice President of Sales, shared his comments: "The enhanced capabilities of the COBRA-II Hybrid Laser System go well beyond that of TCLAD’s older generation COBRA, and will yield premium quality results for their application. The Cobra II can handle the most challenging rigid and flexible circuit board designs. The system is well known worldwide for its reliability and capability. We are excited to have this second system installed at TCLAD’s facility."
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Rachael Temple - AlltematedSuggested Items
Webinar Review, Part 2: Building the AI Backbone at IBM on Systems-level Packaging
04/20/2026 | Marcy LaRont, I-Connect007The second presentation in a recent Global Electronics Association’s Executive Pulse webinar series widened the lens on advanced packaging, moving beyond the component level to a systems-level view of how AI is reshaping the electronics landscape. Building on Dr. Hemanth Dhavaleswarupu of AMD’s previous discussion of chip-level packaging innovation, Dr. Jung Yoon of IBM explored the broader infrastructure implications, from the data center floor to the global supply chain.
Cadence, NVIDIA Expand AI & Accelerated Computing Partnership
04/17/2026 | Cadence Design Systems, Inc.At CadenceLIVE Silicon Valley 2026, Cadence announced an expanded partnership with NVIDIA to deliver accelerated solutions across agentic AI, physics-based simulation and digital twins to unlock new levels of productivity and accelerate next‑generation engineering design flows across semiconductor design, physical AI systems and hyperscale AI factories.
Below the Surface: Looking Ahead to Where Integration Actually Happens
04/20/2026 | Chandra Gupta -- Column: Below the SurfaceProgress in RF rarely arrives and suddenly rewrites the rules. What actually moves performance forward almost always happens in the seams, the interfaces, the choices that determine whether individual parts are allowed to work together, or forced to fight one another. So, when we look ahead in RF systems—from DC through millimeter-wave—the most important conversations aren’t about isolated materials or heroic devices. They’re about integration, and more specifically, about how ceramic-based RF packages and module architectures shape system-level behavior long before the signal ever reaches free space.
From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.
ESD Alliance Reports Electronic System Design Industry Posts $5.5 Billion in Revenue in Q4 2025
04/15/2026 | SEMIElectronic System Design (ESD) industry revenue increased 10.3% to $5,466.3 million in the fourth quarter of 2025 from the $4,955.2 million registered in the fourth quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.