-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Isola Lays Foundations for Faster Circuits at DesignCon 2022
March 28, 2022 | Isola GroupEstimated reading time: 2 minutes
Isola Group, an innovative developer and supplier of top-quality printed circuit boards (PCB) materials, will be exhibiting at the upcoming DesignCon 2022 expo and conference. The event, scheduled for April 5-7, 2022, at the Santa Clara Convention Center (Santa Clara, CA), provides visitors with the chance to learn more about Isola’s reliable, high-performance circuit materials and how they can form the foundations for miniature circuit solutions engineered for the most efficient and practical manufacturing processes.
Isola Group will be well represented at exhibition booth #743, with details and data about its extensive portfolio of circuit materials. The event, in the heart of the historic “Silicon Valley” area of northern California, features a 14-track technical conference and large exhibition area. It is promoted as “Where the Chip Meets the Board,” and Isola is a leading supplier of materials for “the board.” The show highlights the latest, fastest-growing markets in electronics, including Fifth Generation (5G) wireless cellular communications with a growing demand for circuit materials for 5G infrastructure equipment and mobile devices.
Isola’s “material masters” will be on hand to share insights on their premium circuit materials for high-speed-digital (HSD) and RF/microwave (RF/MW) circuits. HSD circuit materials include I-Speed®, I-Tera® MT40, Tachyon® 100G and, for those developing low-loss, halogen-free circuits, the new high-speed TerraGreen® 400G laminates and prepregs, for designs requiring high-level SI performance to 100 Gb/s and beyond. Circuit materials for high-frequency RF/MW circuits include Astra® MT77, I-Tera® MT40 (RF/MW), and IS680/IS680 AG laminates. Standard TerraGreen® circuit materials provide a halogen-free choice for many general-purpose circuits while TerraGreen® 400G (RF/MW) circuit materials offer the halogen-free option at RF, microwave, and higher frequencies. These extremely low-loss circuit materials support circuits into the millimeter-wave (mmWave) frequency range, to 110 GHz.
Since the challenging combination of high circuit density and miniaturization is a growing trend for HSD and RF/MW circuits, visitors to the Isola booth can learn how to combine both types of circuits into compact hybrid PCBs that support multiple-signal operation with multiple-material solutions. Time at the Isola booth can lead to improved understanding of the different circuit materials needed for modern electronic products requiring both HSD and RF/MW circuits, and how compatibility of essential material characteristics, such as coefficient of thermal expansion (CTE), can enable the reliable, long-term coexistence of different circuit materials on a hybrid PCB. High-frequency circuit materials such as Astra® MT77 and I-Tera® MT40 are also FR-4 process compatible for ease of hybrid circuit fabrication.
Download The Printed Circuit Designer’s Guide to... High Performance Materials by Michael Gay. You can also view other titles in our full I-007eBook library here.
Suggested Items
IDTechEx Discusses Low-Loss Materials: The Enabler of Future Connected Vehicles?
05/06/2024 | IDTechExFuture connected vehicles will offer future drivers a safer, smoother, and more convenient driving experience. Not only will drivers get access to more navigation and entertainment options, but they will also gain access to safety technologies that will potentially reduce accidents, improve congestion, and reduce emissions globally by allowing vehicle safety systems to communicate with each other and with city traffic infrastructure.
LQDX Divests Aluminum Soldering Business - Mina™ - to Taiyo America Inc.
05/02/2024 | PRNewswireLQDX, formerly known as Averatek Corp., developer of high-performance materials for advanced semiconductor manufacturing, today announced that it has divested its aluminum soldering business – known as MinaTM – to Taiyo America Inc., a global market leader in advanced electronic materials.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Real Time with... IPC APEX EXPO 2024: Adhesive Materials and Equipment Update with Dymax
05/01/2024 | Real Time with...IPC APEX EXPOVirginia Hogan, global business development manager at Dymax, discusses adhesive materials, dispensing and curing equipment, a new, high-reliability conformal coating, and various materials and dispensing methods.
Real Time with... IPC APEX EXPO 2024: Sustainability in the Industry
04/26/2024 | Real Time with...IPC APEX EXPOGuest Editor Henry Crandall and Chris Nash of Indium Corporation discuss the company's 90th anniversary and its focus on sustainability. They focus on the benefits of sustainable materials, their compatibility, and value propositions. The conversation also highlights how Durafuse LT technology's role in reducing reflow temperatures is leading to significant cost and energy savings. Nash also touches on downstream sustainability efforts such as using recycled materials for packaging.