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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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IPC Establishes European Subsidiary
May 25, 2022 | IPCEstimated reading time: Less than a minute
To better support our European members’ interests, IPC announces the formation of IPC Electronics Europe GmbH. The subsidiary was officially registered with the German government on May 4, 2022. The new entity’s main office is located in central Munich.
John W. Mitchell, IPC president and CEO commented, “While we have been actively engaged and successful in Europe for more than 30 years, having a legal entity here now enhances our ability to serve the regional electronics industry and our membership in newer and bolder ways with renewed vigor.”
“We are very excited about the prospects of actively participating in significant consortiums and working groups in the EU to help drive newer standards, education, and advocacy solutions that will be vital in transforming the continent’s factories of the future,” said Sanjay Huprikar, president of IPC in Europe and South Asia.
IPC has plans in place to expand staff in Europe in addition to Francisco Fourcade who joined IPC in April as electronics standards manager to liaise with the growing number of new standards development committees forming in Europe. The organization will be adding talent to the certification, marketing, and industry intelligence teams over the next 18 months.
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Brent Fischthal - Koh YoungSuggested Items
The Future of Reflow Soldering Is Here
04/16/2026 | Real Time with... APEX EXPOMichael Hanke discusses how Rehm Thermal Systems is revolutionizing thermal solutions in electronics assembly with their innovative flux-free, no-clean soldering process. This is truly a game changing process that eliminates chamber cleaning and streamlines production. Developed with paste suppliers, this advanced technology promises significant time and cost savings while ensuring high-quality results.
MEIKO Electronics Expands ASEAN Footprint with New Vietnam Subsidiary to Support Growing Demand
04/16/2026 | MeikoMEIKO ELECTRONICS CO., LTD. has announced that, at its Board of Directors meeting held on April 8, 2026, the company resolved to establish a wholly owned subsidiary, MEIKO ELECTRONICS YEN QUANG CO., LTD. (MKYQ), in Phu Tho Province, Vietnam.
What’s Next for PCB Materials? I-Connect007 Podcast Series Turns to Supply Chain Resilience
04/16/2026 | I-Connect007 Editorial TeamI-Connect007 continues its six-part podcast series with Isola experts titled, PCB Materials: The Backbone and Future of Electronics, with the release of Episode 5, which shifts focus to one of the industry’s most urgent challenges: supply chain resilience.
AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging
04/16/2026 | I-Connect007 Editorial TeamThe upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.
KYZEN’s Award-Winning AQUANOX A4618 to Be Featured at SMTA Huntsville and Atlanta Expo & Tech Forums
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