Cadence Shifts into High Gear with McLaren Racing
May 26, 2022 | Cadence Design Systems, Inc.Estimated reading time: 1 minute
Cadence Design Systems, Inc. announced that it has become an Official Technology Partner of the McLaren Formula 1 Team. Through the multi-year partnership, McLaren has access to Cadence Fidelity CFD Software, which provides innovative aerodynamic prediction tools that can help accelerate the team’s path toward victory.
In racing, shaving off a fraction of a second per lap can make all the difference when it comes to a podium finish. McLaren will use the Cadence Fidelity CFD Software, a comprehensive suite of computational fluid dynamics (CFD) solutions, to investigate airflow. The team will also leverage Cadence’s computational software expertise to tackle design projects that require advanced compute power and precision.
“We’re delighted to welcome Cadence to the McLaren Racing family. Cadence is a technology leader that prioritizes innovation. Its CFD and advanced electronic technologies will be crucial assets for our design operations. We look forward to a fast-paced collaboration that supports our constant drive to boost our on-track performance. The Monaco Grand Prix is a fantastic event to launch our partnership, and we’re excited that Cadence will join our brand across multiple race series this weekend by running on the Arrow McLaren SP cars for the Indy 500,” said Matt Dennington, director of partnerships, McLaren Racing.
“As part of the McLaren Racing family, we’re bringing our Fidelity CFD Software to the team and supporting the team in its ongoing pursuit of boosting performance. We will collaborate with McLaren to continually push and innovate. We’re looking forward to the multi-year partnership and achieving milestones together that put the team on the road to victory,” said KT Moore, vice president, Corporate Marketing, Cadence.
Suggested Items
Robosys, ACUA Ocean + OREC Secure Funding For Collaborative Autonomy Project
12/25/2024 | RobosysAdvanced maritime autonomy developer, Robosys Automation, supported by USV manufacturer, ACUA Ocean, and Offshore Renewable Energy Catapult (OREC), have jointly secured grant funding through Innovate UK.
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Spotlight on PEDC: Filbert Arzola
12/19/2024 | Andy Shaughnessy, Design007 MagazineIPC and FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30 at the NH Danube City hotel in Vienna. Raytheon’s Filbert Arzola is presenting “Engineering and Adapting Model-based PCB Design in Step with Sustainability and Digital Twins” at PEDC. I asked Filbert to discuss what attendees can expect from his class.
Avnet Insights: Engineers Outline Opportunity for AI
12/19/2024 | AvnetFor the fourth consecutive year, Avnet, Inc. (Nasdaq: AVT) will release its Avnet Insights survey, which has been keeping a pulse on how engineers are responding to the market since 2021. This year’s survey examines technology’s new frontier: Artificial Intelligence, and the promise – and challenges – it presents for product design.