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Robosys, ACUA Ocean + OREC Secure Funding For Collaborative Autonomy Project

12/25/2024 | Robosys
Advanced maritime autonomy developer, Robosys Automation, supported by USV manufacturer, ACUA Ocean, and Offshore Renewable Energy Catapult (OREC), have jointly secured grant funding through Innovate UK.

IPC Announces New Training Course: PCB Design for Military & Aerospace Applications

12/23/2024 | IPC
IPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.

Effects of Advanced Packaging and Stackup Design

12/26/2024 | I-Connect007 Editorial Team
Kris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”

Spotlight on PEDC: Filbert Arzola 

12/19/2024 | Andy Shaughnessy, Design007 Magazine
IPC and FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30 at the NH Danube City hotel in Vienna. Raytheon’s Filbert Arzola is presenting “Engineering and Adapting Model-based PCB Design in Step with Sustainability and Digital Twins” at PEDC. I asked Filbert to discuss what attendees can expect from his class.

Avnet Insights: Engineers Outline Opportunity for AI

12/19/2024 | Avnet
For the fourth consecutive year, Avnet, Inc. (Nasdaq: AVT) will release its Avnet Insights survey, which has been keeping a pulse on how engineers are responding to the market since 2021. This year’s survey examines technology’s new frontier: Artificial Intelligence, and the promise – and challenges – it presents for product design.
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