Cadence Design IP Portfolio in TSMC’s N5 Process Gains Broad Adoption Among Leading Semiconductor, System Companies
June 16, 2022 | Cadence Design Systems, Inc.Estimated reading time: 1 minute
Cadence Design Systems, Inc. announced a wide range of leading semiconductor and system customers have successfully adopted the comprehensive line-up of Cadence® Design IP in TSMC’s industry-leading 5nm process technology. Designed to the latest state-of-the-art interface standards, the Cadence’s Design IP portfolio enables customers to develop the most advanced SoCs for the most demanding applications, including high-performance computing (HPC), artificial intelligence/machine learning (AI/ML), networking, storage, and automotive. The IP portfolio from Cadence in TSMC’s N5 process includes 112/56/25/10 Gbps Ethernet PHY/MAC, PCIe 6.0/5.0/4.0/3.1 PHY/Controller, 40Gbps Ultralink™ D2D PHY, and complete PHY/Controller for GDDR6, DDR5/4, and LPDDR5/4x.
Cadence’s design IP in TSMC’s N5 process delivers optimal power, performance and area (PPA) with rich feature sets to enable uncompromised differentiation, versatility and innovation for large-scale SoC designs. In addition, Cadence provides full subsystem deliveries with integrated PHY and controller IP to simplify integration, minimize risks, and enable faster time to market.
“TSMC worked closely with Cadence, our long-standing ecosystem partner, to enable leading-edge designs, which deliver significant power, performance and area improvements on our advanced technologies,” said Suk Lee, vice president of the Design Infrastructure Management Division at TSMC. “The strong collaboration between Cadence’s Design IP and TSMC’s IP9000 teams promotes high-quality IP delivery to help our mutual customers achieve first-pass silicon success and faster time-to-market.
"Cadence has collaborated with TSMC for decades to provide high-quality silicon-proven IP on advanced process nodes to meet the most demanding requirements for HPC, AI/ML, networking, storage, and automotive applications,” said Rishi Chugh, vice president of Design IP Product Management at Cadence. "The wide adoption of our Design IP in TSMC’s N5 process demonstrates the excellence and quality of Cadence’s Design IP, which is empowering customers to design highly differentiated product solutions.”
Suggested Items
Polar Brings New Book 'The PCB Designers Guide to... More Secrets of High Speed PCBs' to EIPC Edinburgh
05/27/2025 | Polar InstrumentsPolar's latest book, The PCB Designer's Guide to... More Secrets of High Speed PCBs, will see its European Launch at the EIPC conference in Edinburgh, June 3-4, 2025. More Secrets unveils more of the knowledge that is often missed from theoretical text books to help both new and experienced designers realize the PCBs they “thought” they had designed.
FastlinkPCB Accelerates Global Expansion, Builds Efficient PCB Industry Chain
05/26/2025 | FastlinkPCBFastlinkPCB, a PCB manufacturing and assembly solutions provider, announced that it has completed the layout of subsidiaries in the US, Germany, Switzerland, and Malaysia over the past year, forming a localized service network covering North America, Europe, and Southeast Asia.
Defining the Ideal PCB Design Data Output
05/27/2025 | Stephen V. Chavez, Siemens EDAAt the heart of delivering successful, manufacturable printed circuit boards lies a vital question: What should your design data output package include to best support manufacturing? The answer: It depends. There are many factors to consider regarding the specific category you’re designing for—such as mil/aero, space, medical, and commercial. Other factors that need to be considered are requirements and engineering intent.
Indium to Feature Materials Solutions for Semiconductor Packaging and Assembly at ECTC
05/22/2025 | Indium CorporationIndium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the Electronics Component and Technology Conference (ECTC), taking place May 27-30 in Dallas, Texas.
HBM4 Raises the Bar on Manufacturing Complexity, Premium Expected to Exceed 30%
05/22/2025 | TrendForceTrendForce's latest findings reveal that demand for AI servers continues to accelerate the development of HBM technologies, with the three major suppliers actively advancing their HBM4 product roadmaps.