-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Rogers Official Partner of EU´s €95B Innovation Program: Horizon Europe
July 11, 2022 | Rogers CorporationEstimated reading time: 1 minute
Rogers Corporation's announced its participation in the European Union´s €95B innovation program, Horizon Europe, through the POWERDRIVE project: power electronics optimization for next-generation electric vehicle components.
Horizon Europe is the European Union's key funding program to address global challenges and enhance industrial competitiveness in Europe through implementing governmental policies. It is established to provide long-term support until 2027 for a wide range of projects related to health, agriculture, climate, energy, mobility and more. Established between universities and private companies, POWERDRIVE aims to develop advanced mobility solutions to enhance performance, increase autonomous driving and reduce manufacturing costs.
According to Jeff Tsao, Rogers Corporation Vice President and General Manager PES, “It is truly an honor for the Rogers ROLINX® team to have been selected to participate in this prestigious program partnering with the best companies and institutions. The Rogers team is very excited not only for the opportunity to deliver high performance, reliable and cost-effective power interconnect solutions for next generation renewable systems and electrical vehicles, but also to serve a higher purpose to enable a greener planet and create a cleaner environment for our future generations.”
Rogers will offer its ROLINX® Power Interconnect, an integrated busbar solution that delivers exceptional performance in power distribution with the full range of laminated and powder-coated busbars. Partnering with key stakeholders, the ROLINX® team will put forward 40+ years of design experience and process engineering capability to accelerate system-level optimization.
This project is part of HORIZON-CL5-2021-D5-01-02 and is being carried out with the support of the European Commission.
Suggested Items
Real Time with… IPC APEX EXPO 2024: The Latest Advancements in Dry Storage
04/30/2024 | Real Time with...IPC APEX EXPOEditor Marcy LaRont and Super Dry Totech's Jordan Mandel discuss the latest developments in dry storage solutions, the J standard, and the ongoing challenge of moisture management while highlighting the industry's shift toward smart solutions and the importance of seeking expert help for moisture mitigation.
Keysight Secures New Test Case Validations for Narrowband Non-Terrestrial Networks Standard
04/30/2024 | Keysight TechnologiesKeysight Technologies, Inc. has validated new conformance test cases for 3rd Generation Partnership Project (3GPP) Release 17 (Rel-17) standards for non-terrestrial networks (NTN) using narrowband internet of things (NB-IoT) technology.
IDTechEx Report on Quantum Technology: Nano-scale Physics for Massive Market Impact
04/30/2024 | PRNewswireThe quantum technology market leverages nano-scale physics to create revolutionary new devices for computing, sensing, and communications. Across the industry, quantum technology offers a paradigm shift in performance compared with incumbent solutions.
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
04/30/2024 | PRNewswireAnsys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.
New Appointment Strengthens Ventec’s Value-Added Equipment Division
04/29/2024 | VentecVentec announces the appointment of Leigh Allinson as Commercial Director for its value-added PCB Equipment division 'Ventec Giga Solutions'.