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April 30, 2024 | Marcy LaRont, PCB007 MagazineEstimated reading time: 2 minutes
Tom Edman has been the CEO of TTM Technologies since 2014 and has an extensive background in electronics and manufacturing. TTM is a leading global manufacturer of technology solutions, including mission systems, RF component and RF microwave microelectronics assemblies, and quick turn and advanced technology printed circuit boards.
In this interview, Tom discusses the decision-making behind TTM’s new ultra HDI PCB facility in Syracuse, New York, where the company already has a 160,000-square-foot RF microwave and microelectronics facility. He highlights TTM's commitment to innovation and meeting the dynamic demands of the industry, touches on the industry's need for supply chain resiliency and engagement with OEMs, and discusses what he finds most exciting about our industry right now.
Marcy LaRont: On its face, it would seem like Syracuse naturally pops to the top of the list for your expansion. What criteria did you use in your selection?
Tom Edman: We started with about 16 states as candidates, narrowed that down to 10 states for a more in-depth review, and then ended with two finalists. At the end of the day, it was much more than just a state incentive package. For us, it all starts with the quality of the people we can find in a particular area.
Both our RF microwave and microelectronics facility and our RF component facility are in the local area, which means we have the available infrastructure and a very strong engineering organization to help support the planning and the startup of this facility. The tipping point was the quality of the workforce and the infrastructure available, combined with very strong government support at the state and local levels. That convinced us Syracuse was the place for TTM to expand.
LaRont: As CEO, you are very plugged into advocacy efforts—Senate Majority Leader Chuck Schumer called you himself to persuade you to build in New York. How has this type of activity affected your approach to business?
Edman: We really started our involvement in Washington, D.C., in 2018 because our critical customers in the commercial world were talking about the need for supply chain resiliency. As we surveyed our own footprint and future expansion plans, we quickly concluded that we needed a voice in Washington regarding the necessary infrastructure requirements to enhance microelectronics manufacturing technology and capacity in the U.S. and support our industry domestically. We’ve all watched as the world change, and so much of our business shifted to Asia. We realized that starting to reverse the offshoring trend and grow U.S microelectronics manufacturing would take incredible persistence, the support of our customers, and a set of incentives at the government level that reinforce the need for supply chain resiliency. The best way to create an environment for printed circuit board production in North America is to create a strong and resilient demand environment.
To read this entire conversation, which appeared in the April 2024 issue of PCB007 Magazine, click here.
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