Dan’s Biz Bookshelf: ‘Believe in Better'
The Big Picture: Our Big ‘Why’ in the Age of AI
The Chemical Connection: Through-glass Vias in Glass Substrates
IPC Offers First Advanced Packaging Symposium
August 5, 2022 | IPCEstimated reading time: 1 minute
Registration is now open for the first IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem, to be held October 11-12, 2022, at the Kimpton Hotel Monaco in Washington, D.C. Focusing on the opportunities and challenges for next-generation advanced packaging production, the IPC Advanced Packaging Symposium offers in-depth discussions on strengthening the IC-substrate and package assembly ecosystem across North America and Europe.
“Fundamental changes in the semiconductor sector are impacting the electronics manufacturing supply chain, and lines are blurring between IC-substrate and printed circuit board fabrication and between semiconductor and electronics assembly,” said Matt Kelly, IPC chief technologist. “Understanding these industry changes will ensure the emergence of innovative, well-balanced, and resilient ecosystems to support the production of the most cutting-edge semiconductor components.”
The two-day event, which includes three keynotes, 28 speakers, and eight sessions, will bring commercial and defense electronic industry leaders together to focus on high-priority needs for IC-substrates and packaging, to identify key challenges to overcome, enabling sustainable businesses over the long run, to move past general issue awareness into actionable research, development, design, and business operations execution, and to provide attendees with actionable next steps and an expanded network for continued development efforts.
Attendees can expect:
Speakers that span the advanced packaging ecosystem and semiconductor supply chain: component makers, HDI PCB fabricators, market-leading IC-Substrate fabricators, assembly and test manufacturers, equipment, and material suppliers.
Three keynotes from senior leaders at Intel, Department of Defense, and TechSearch International.
An eight-session agenda includes the latest insights from the Department of Commerce, Department of Defense, European Commission, Intel, NIST, Northrop Grumman, Raytheon, Schweizer Electronic, SEMCO, SkyWater, TechSearch International, TTM, and Western Digital among others.
For information on registration, visit: IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem.
Share on:
Suggested Items
PCBA Market to Reach $147.5 Billion by 2035, Growing at a CAGR of 4.7% from 2025
06/27/2025 | PRNewswireThe Printed Circuit Board Assembly market is projected to reach $147.5 billion by 2035, up from an estimated $90.91 billion in 2025, growing at a steady CAGR of 4.7% during the forecast period.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
ASC Sunstone Circuits and Screaming Circuits Partner to Launch Online Assembly Parts Ordering – A New Step Toward Seamless PCB Production
06/23/2025 | ASC SunstoneIn a major step toward simplifying the PCB manufacturing and assembly process, ASC Sunstone Circuits and Screaming Circuits are proud to announce the launch of a new online assembly parts ordering feature, now available through Sunstone.com. This enhanced capability allows customers to source assembly components as part of their PCB order, creating a fully integrated experience from bare board fabrication to finished assembly.
STI Celebrates Travis Wease’s 10 Years of Dedicated Service
06/17/2025 | STI Electronics, Inc.STI Electronics, Inc., a full-service organization providing training services, training materials, analytical/failure analysis, prototyping, and contract electronic manufacturing, proudly celebrated the 10-year work anniversary of Travis Wease, Master Instructor and valued team member.