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This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
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Suhani Chitalia Joins IPC as New Environmental Regulatory Affairs Manager
August 23, 2022 | IPCEstimated reading time: 1 minute
IPC announces the addition of Suhani Chitalia to its environmental health and safety staff within the Washington, D.C.-based global government relations team.
As IPC’s environmental regulatory affairs manager, Chitalia is responsible for monitoring global environmental policy developments and regulatory requirements, liaising with industry members and policymakers, and developing responses to consultations, questionnaires, and calls for evidence from government entities.
Licensed to practice law in the state of Maryland, Chitalia served as an environmental law staff attorney at the University of Maryland School Francis King Carey School of Law and most recently as a government relations associate at lobbying firm, Public Policy Partners. She has extensive experience lobbying for climate change and environmental health legislation, and advocating for environmental justice concerns and public health in Maryland.
“The landscape of emerging and evolving environmental policies, including chemical and product policies relevant to the electronics manufacturing supply chain, is dynamic and full of opportunities to do meaningful work and Suhani has a proven track record of meaningful work,” said Kelly Scanlon, director of EHS policy and research. “She has presented and provided expertise on complex legislation and is an excellent addition to the EHS team. She will help us to continue to provide exceptional membership and industry value through advocacy. We are really excited to welcome Suhani to IPC.”
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Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.