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Meet with KYZEN at the MCA How Clean Is Clean – Aerospace Expo
February 20, 2023 | KYZEN'Estimated reading time: 1 minute
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the MCA How Clean Is Clean – Aerospace Exhibition, scheduled to take place Tuesday, March 7, 2023, at the Jackson Center in Huntsville, Alabama. The KYZEN team will discuss the benefits of its METALNOX M6920 VOC Free Solvent Cleaner, METALNOX M6386 Modified Alcohol Solvent Cleaner and METALNOX M6381 Precision Hydrocarbon Solvent Cleaner.
METALNOX M6920 is a highly effective VOC free cleaning solution intended for use in vapor degreasing equipment, cold cleaning and manual cleaning, and is a suitable replacement for AK225. It has proven compatible with a variety of metal parts, such as stainless steel, copper, iron, aluminum, and titanium. METALNOX M6920 also works well with alloys used in precision cleaning industries such as aerospace, automotive, medical, electronics and defense.
METALNOX M6386 is a modified alcohol-based solvent blend designed for use in automated vacuum degreasing parts cleaning machines. The cleaner is highly effective on paraffinic and water-based oils, cutting fluids and milling fluids commonly used to forge and cast metal hardware, fasteners and components.
METALNOX M6381 is a hydrocarbon solvent cleaner formulated for use on non-polar soils and is commonly used to clean parts supplied to the automotive, medical, aerospace, and other high-tech industries. M6381 is most effective in vacuum degreasing, immersion, and manual applications.
As several traditional degreasing solvents face drastic exposure limit restrictions, KYZEN has safe and effective alternatives. KYZEN'S cleaning experts can evaluate your current cleaning process and parameters to help you choose products that will be a good fit with your process, as well as satisfy your cleanliness standards. METALNOX M6920, M6381 and M6386 meet U.S. EPA requirements for your vacuum and vapor degreasing cleaning processes.
Suggested Items
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.