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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Integr8tor and UcamX v2023.01 are Now Available
March 6, 2023 | UcamcoEstimated reading time: Less than a minute

Ucamco is proud to release Integr8tor v2023.01 and UcamX v2023.01. These new versions of our Pre-CAM and CAM software include plenty of additions to increase our customers’ productivity, highlighted by the topics below.
Integr8tor v2023.01
- Yellow solder mask color
- Plated/non-plated/backdrill-to-copper clearance analysis
- Conditional formatting
- Agile job queue handling
- Performance and security
- DPMX import
UcamX v2023.01
- YELO Mask Adjuster
- Object Summary Table
- Magnifier II
- Rout Manager
- Input GDSII
- SmartTest
- CAD Output Gerber X2/X3
- Input Drill/Rout
- Check for update
Integr8tor and UcamX v2023.01 are now available for download for all maintenance contract users. Customers who wish to upgrade to this version outside of a maintenance contract or wish to take out a maintenance contract.
Suggested Items
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.