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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Sarah Czaplewski-Campbell: Ready to Take Flight
March 17, 2023 | Patty Goldman, I-Connect007Estimated reading time: 1 minute

Sarah Czaplewski-Campbell, a materials/product development engineer at IBM, shares her experiences as a young professional who has benefited from the guidance of seasoned mentors alongside her own unflagging drive to expand her industry knowledge. She offers poignant advice for prospective professionals, urging them to assertively seek out advice and experiences that will help them progress in their careers.
Patty Goldman: Sarah, congratulations on your Rising Star Award. How long have you been involved with IPC?
Sarah Czaplewski-Campbell: Thank you. I’ve been involved with IPC for about four years. I initially got involved through the Emerging Engineers program.
Goldman: Great! How has IPC helped you in your career?
Czaplewski-Campbell: IPC has helped to build my electronics industry knowledge and network. As part of the Emerging Engineers program, I was exposed to Professional Development Courses and technical presentations that not only helped grow my knowledge but sparked interest in new technologies, which I found very beneficial. The program connected me with industry experts whom I could learn from and collaborate with. Since then, I’ve become involved in the IPC APEX EXPO Technical Program Committee; I’m helping to review the technical content of the papers for the conference. That work has helped further progress my knowledge and engage with the industry.
Goldman: What technologies in electronics have you most excited?
Czaplewski-Campbell: I am excited about quantum computing and the impact that it can have across multiple industries, such as the impact on drug discovery and personalized medicine. There are also many interesting engineering and reliability challenges when working with hardware at the ultra-low temperatures required for quantum computing.
To read this entire conversation, which appeared in the 2023 edition of Show & Tell Magazine, click here.
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