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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
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Survey: Business Goals and Benchmarking
April 17, 2023 | Andy Shaughnessy, I-Connect007Estimated reading time: Less than a minute

We want your input!
PCB fabricators have been utilizing benchmarks for decades, comparing metrics for everything from manufacturing best practices to competitors’ products and services. Now, we have access to more manufacturing data than ever before, and companies can conduct benchmarking at a granular level.
In this survey, we’re asking PCB007 readers to discuss their business goals and benchmarking processes. The results will be published in upcoming issues of PCB007 Magazine.
To take this survey, click here.
What is your company's benchmarking process?
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Real Time with... IPC APEX EXPO 2025: GreenSource's Growth and Future Developments
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Hon Hai Product Chief Xiao Caiyou Elected as Member of the Board of Directors of the NAM
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STMicroelectronics Details Company-Wide Program to Reshape Manufacturing Footprint and Resize Global Cost Base
04/14/2025 | STMicroelectronicsSTMicroelectronics N.V., a global semiconductor leader serving customers across the spectrum of electronics applications, disclosed further elements of its program to reshape its global manufacturing footprint.