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Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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Survey: Business Goals and Benchmarking
April 17, 2023 | Andy Shaughnessy, I-Connect007Estimated reading time: Less than a minute

We want your input!
PCB fabricators have been utilizing benchmarks for decades, comparing metrics for everything from manufacturing best practices to competitors’ products and services. Now, we have access to more manufacturing data than ever before, and companies can conduct benchmarking at a granular level.
In this survey, we’re asking PCB007 readers to discuss their business goals and benchmarking processes. The results will be published in upcoming issues of PCB007 Magazine.
To take this survey, click here.
What is your company's benchmarking process?
Testimonial
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Julia McCaffrey - NCAB GroupSuggested Items
Sypris Reports Second Quarter Results
08/12/2025 | BUSINESS WIREThe Company’s second quarter revenue decreased compared to the prior-year quarter primarily due to the near-term impact of tariffs, which reduced demand from certain transportation-related customers and necessitated the conversion of certain shipments from our facility in Mexico to a value-add only sub-maquiladora.
Koh Young Highlighting Dimensional Metrology & Inspection Solutions at the Binghamton University Electronics Packaging Symposium
08/12/2025 | Koh YoungKoh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, is proud to announce its sponsorship and participation in the 36th Annual Electronics Packaging Symposium (EPS), hosted at the GE Aerospace Research Campus in Niskayuna, New York, on September 03-04, 2025.
Former Intel Directors Warn of U.S. Chip Leadership Collapse
08/11/2025 | I-Connect007 Editorial TeamEarlier this month, former Intel board members warned that the company’s retreat from advanced semiconductor manufacturing will threaten U.S. leadership in AI and other critical technologies, Forbes reported.
Facing the Future: Challenges and Opportunities in Reshoring PCB Manufacturing
08/12/2025 | Prashant Patel -- Column: Facing the FutureFor decades, offshore manufacturing dominated the global electronics industry. The pursuit of cost efficiency, scalability, and access to vast labor markets made countries like China, Taiwan, and Vietnam attractive destinations for printed circuit board (PCB) production. But a seismic shift is underway, from geopolitical instability and supply chain disruptions to rising labor costs and national security concerns.
ASMPT Announces Strategic Optimization of Manufacturing Operations, Closes Shenzhen Factory
08/11/2025 | ASMPTASMPT, a global leader in semiconductor and electronics manufacturing, announced today a strategic optimization of its manufacturing operations in China.