Ansys Joins TSMC's OIP Cloud Alliance for Secure Multiphysics Analysis in the Cloud
April 27, 2023 | ANSYSEstimated reading time: 1 minute
Ansys announced that it has joined TSMC's OIP Cloud Alliance to facilitate the deployment of fully distributed workflows for mutual customers. By driving toward the cloud interoperability of Ansys multiphysics solutions with TSMC's technology enablement, customers will easily be able to gain the full benefits of faster run times and elastic computing with major cloud vendors.
Combining EDA parallelism and cloud scalability, TSMC and its OIP Cloud Alliance partners are creating next-generation, cloud-optimized design methodologies to further accelerate turnaround time of critical design tasks. Ansys and other EDA partners will optimize their tools for multi-threaded, fully-distributed runs to best utilize cloud, while cloud partners will bring new virtual machines most suitable for the EDA workload of IC designs.
"Our customers of all sizes are leveraging the cloud to boost productivity while designing in TSMC's leading-edge technologies for new applications from high performance computing to mobile, artificial intelligence, networking, and 3D-IC," said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. "By welcoming Ansys as the latest member into our OIP Cloud Alliance, TSMC aims to make Ansys' leading multiphysics signoff solutions available to all of our customers and help them bring their differentiated products to market sooner, with higher quality."
Ansys was an early adopter of elastic cloud computing with its SeaScape big-data platform – a cloud-native data infrastructure that was designed specifically for EDA. Ansys® RedHawk-SC™ was the first tool built to work with SeaScape (SC) and many other Ansys semiconductor tools have followed, including Ansys® PathFinder-SC™, Ansys® Totem-SC™, and Ansys® PowerArtist-SC™.
"Ansys' strategy for the future foresees an absolutely central role for cloud computing," said John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Ansys. "We have invested heavily in cloud-enabled platforms that give our products clear advantages in speed and capacity over traditional tool environments that were not designed for the cloud."
Suggested Items
Sondrel Awarded New Video Processor ASIC Design and Supply Contract
05/09/2024 | SondrelSondrel, a leading provider of ultra-complex custom chips for leading global technology brands, is pleased to announce that it has won a major ASIC design and supply contract for a next generation, video processing chip.
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Siemens Delivers New Solido IP Validation Suite
05/07/2024 | SiemensSiemens Digital Industries Software introduced Solido™ IP Validation Suite software, a comprehensive, automated signoff solution for quality assurance across all design intellectual property (IP) types, including standard cells, memories and IP blocks.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/07/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.