Optomec Showcases Latest Additive Manufacturing Print Heads at RAPID + TCT 2023
May 3, 2023 | Business WireEstimated reading time: 1 minute

Optomec, a leading manufacturer of Additive Manufacturing machines for both 3D Printed Metal and Printed Electronics will showcase its latest print solutions for each technology at RAPID + TCT 2023. For 3D Printed Metal, Optomec will be displaying its LDH 3.1 print head for Directed Energy Deposition (DED) that allows users to change the spot size of the laser during a build or repair. For Printed Electronics customers, Optomec will announce its latest Aerosol Jet® print head which delivers a compact, low maintenance solution for production applications. Optomec will be showing these new solutions in booth 5027.
The LDH 3.1 print head delivers superior 3D metal builds by allowing the operator to vary the laser spot size and power density remotely and therefore optimize the deposition for print speed and metallurgical properties. For example, larger portions of the build can utilize a larger laser spot for a higher deposition rate while a smaller laser spot can be used for finer features of the build. This can be accomplished remotely, without breaking the inert atmosphere of the machine’s build chamber.
The new Endurance print head for Aerosol Jet machines delivers a compact, simplified print head for electronics production. The new design is optimized for longer operating runs and quicker maintenance. It is available with an ultrasonic atomizer for use on a variety of inks. Optomec’s Printed Electronics machines enable manufacturers to create extremely fine 3D electronic structures–such as circuits, sensors, antennas and interconnects–with features as small as 10 microns using nanoparticle inks. The machines are widely used in the Aerospace and Defense, Energy, Medical Device, Advanced Electronics Packaging and Research segments.
“We are pleased to be showcasing our latest production print solutions at RAPID this year.” said Mike Dean, VP of Marketing at Optomec. “On both sides of business--printed metal and printed electronics--we have been innovating in the base print technology at the heart of the additive machine. Both the LDH 3.1, which began shipping recently, and the Endurance print head, which we are just announcing, were developed in response to our production customers who are looking for robust AM processes that are easy to integrate into their operations.”
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
NOVOSENSE, UAES and Innoscience Advance Power Electronics for New Energy Vehicles
10/17/2025 | PRNewswireThe partnership focuses on developing next-generation intelligent integrated Gallium Nitride (GaN) products. Leveraging their combined expertise, the new devices will deliver more reliable GaN driving and protection features, enabling higher power density and paving the way for wider adoption in automotive systems.
Jabil Announces Board Transitions
10/17/2025 | JabilJabil Inc. announced that Executive Chairman of the Board of Directors Mark T. Mondello and Directors Kathleen A. Walters and Jamie Siminoff will not seek re-election at Jabil’s Annual Meeting of Stockholders in January 2026.
StenTech Strengthens Precision Parts Platform with AME Acquisition
10/17/2025 | StenTechStenTech, North America’s leading provider of SMT printing solutions and precision manufacturing, has announced the acquisition of Advanced Metal Etching, Inc. (AME), a recognized specialist in chemically etched and laser cut precision parts.
MKS’ Atotech, ESI to Participate in TPCA Show & IMPACT Conference 2025
10/17/2025 | MKS’ AtotechMKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands Atotech (process chemicals, equipment, software, and services) and ESI (laser systems) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming 26th TPCA Show 2025 to be held at the Taipei Nangang Exhibition Center from 22-24 October 2025.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.