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Aspocomp Starts Change Negotiations on Possible Temporary Layoffs at its Oulu Plant
August 15, 2023 | AspocompEstimated reading time: Less than a minute

Aspocomp starts change negotiations on possible temporary layoffs at its Oulu plant in Finland. On August 15, 2023, Aspocomp has issued a negotiation proposal in accordance with the Act on Cooperation to start change negotiations for production-related and financial reasons at its Oulu plant. The majority of the Oulu plant’s approximately 120 production blue-collar employees are covered by the negotiations. The change negotiations are estimated to last two weeks, and the possible temporary layoffs would last a maximum of 90 days.
With the change negotiations, the company prepares for a possible partial adjustment of production to correspond to temporarily low delivery volumes. Slower-than-expected recovery of the semiconductor cycle and high inventory levels in various parts of the value chain has slowed down net sales. A temporary slowdown in the semiconductor cycle is typical for the industry. The industry's long-term growth prospects are still strong. The cycle of the semiconductor industry is expected to return to growth at the end of the year or the beginning of 2024.
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SEMICON West: The Path to a $1 Trillion Future
10/14/2025 | Marcy LaRont, I-Connect007After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.
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Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.
The Training Connection, LLC Welcomes Industry Veteran Jack Harris to Lead Training Partnerships
10/07/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce that Jack Harris, one of the most recognized names in electronics manufacturing training and technical development, has joined the company as Relationship Lead, Training.