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Current IssueThe Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
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We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
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AGC Multi Material America to Participate in PCB West Exhibition
August 31, 2023 | AGC Multi Material AmericaEstimated reading time: Less than a minute

AGC Multi Material America is participating in the PCB West Exhibition in Santa Clara, California on September 20, 2023.
Visit us at Booth 305 to learn more about AGC Multi Material’s comprehensive material offering. Ask about fastRise bondply materials, Meteorwave low loss substrates and ELL, our newest, extremely low loss laminate and prepreg series.
PCB West is the largest conference and exhibition for printed circuit board design, fabrication and assembly in the Silicon Valley.
Suggested Items
INEMI Sessions at IPC APEX EXPO Focus is on Board Assembly and PCB & Laminates
03/12/2025 | iNEMIIf you plan to attend the upcoming IPC APEX EXPO in Anaheim, California, be sure to add the INEMI sessions to your calendar. We will have two forward-looking sessions — one on PCB and Laminates and the other on Board Assembly.
Rogers Corporation Launches New Thermoset Laminates for Automotive Radar Sensor Applications
03/03/2025 | Rogers CorporationRogers Corporation (NYSE:ROG) announced its latest innovation in dielectric materials: RO4830™ Plus Circuit Materials, which are well suited for cost-sensitive millimeter wave PCB applications, such as 76-81 GHz automotive corner radar sensors.
Unveiling the Future: Insights on Next-Gen Megtron Materials
02/13/2025 | Marcy LaRont, I-Connect007In this interview from DesignCon, Jim Kenny, OEM business development manager at Panasonic, touches on next-generation Megtron materials and delves into the industry's growing demand for high-speed, low-loss laminate systems, particularly in light of the anticipated 224 gigabits per second technology. With a focus on material development and production timelines, Jim highlights the challenges and opportunities in meeting customer needs while also maintaining quality and supply chain stability. As Panasonic prepares for the evolving landscape, they remain committed to innovating in this competitive market.
DuPont Sets the Stage for Electronics Innovation at DesignCon 2025 Expo
01/29/2025 | DuPontDuPont, a leader in advanced material solutions and technologies, proudly announces its participation at DesignCon 2025 Expo, taking place January 29 - 30 in Santa Clara, California.
BOOK EXCERPT: The Printed Circuit Designer’s Guide to... High Performance Materials, Chapter 4
01/02/2025 | I-Connect007In Chapter 4, Michael Gay discusses the two main types of copper foil used for PCB boards today: electrodeposited (ED) foil and rolled annealed (RA) foil. He also explains the pros and cons of each, and provides an update of the latest innovations in copper foil technology.