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Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
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USPAE Announces Significant Response to DBX Microelectronics Challenge
October 18, 2023 | USPAEEstimated reading time: 1 minute
The U.S. Partnership for Assured Electronics (USPAE) announced that the Defense Business Accelerator (DBX) Microelectronics Challenge received twice the number of entries expected. Nearly two-thirds of the entrants are startups, and one-third are small- to medium-sized businesses. All are vying for a chance at awards between $500,000 and $2 million to advance commercially viable microelectronics solutions.
“We are very excited by the quantity and quality of the DBX entries for innovative electronic technologies and materials,” said Nathan Edwards, USPAE executive director. “This program helps advance solutions that will have commercial and defense applications while further strengthening the U.S. electronics industry.”
In a few weeks, finalists will be notified and invited to pitch their solutions at the Defense TechConnect Innovation Summit & Expo in late November.
“Defense TechConnect draws leaders from private industry, investment and government to accelerate state-of-the-art technology solutions,” said Matt Laudon, vice president of the TechConnect Division at ATI. “The DBX project is a great example of how new approaches can leverage innovation hubs to achieve great success.”
The innovative DBX program brings together the electronics industry expertise of USPAE with the U.S. Department of Defense’s (DoD’s) Manufacturing, Capability Expansion, and Investment Prioritization Directorate (MCEIP) to award funding through a process meant to accelerate the development of commercial solutions that the DoD can then leverage.
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Firefly Aerospace Announces Strategic Acquisition of SciTec to Advance National Security Capabilities
10/07/2025 | Firefly AerospaceFirefly Aerospace, a market leading space and defense technology company, has entered into a definitive agreement to acquire SciTec, Inc., a leader in advanced national security technologies, for approximately $855 million through a combination of $300 million in cash and $555 million in Firefly shares issued to SciTec owners at a price of $50 per share.
Looking to Reduce Your Consumables Spend? Visit ROCKA Solutions at SMTA International
09/29/2025 | ROCKA SolutionsROCKA Solutions, a trusted North American manufacturer and distributor of high-quality consumables for the electronics manufacturing industry, is pleased to announce its participation at SMTA International 2025, taking place October 19–23, 2025, at the Donald E. Stephens Convention Center in Rosemont, Illinois. Attendees can connect with the ROCKA team at Booth #2413.
Marcy’s Musings: Advancing the Advanced Materials Discussion
09/17/2025 | Marcy LaRont -- Column: Marcy's MusingsAs the industry’s most trusted global source of original content about the electronics supply chain, we continually ask you about your concerns, what you care about, and what you most want to learn about. Your responses are insightful and valuable. Thank you for caring enough to provide useful feedback and engage in dialogue.
September 2025 PCB007 Magazine: The Future of Advanced Materials
09/16/2025 | I-Connect007 Editorial TeamMoore’s Law is no more, and the advanced material solutions being developed to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.