Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Nolan’s Notes: Soldering Technologies
AIM Solder’s New NC259FPA Ultrafine No Clean Solder Paste Wins MiniLED Materials Award at Hangjia
December 15, 2023 | AIMEstimated reading time: 1 minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is proud to announce that its groundbreaking product, NC259FPA Ultrafine No Clean Solder Paste, has been honored with the Most Influential MiniLED Materials Award at the recent Hangjia Aurora Awards Ceremony. This prestigious accolade was presented during the annual Mini/Micro LED Conference held in Hangjia, China.
The NC259FPA is a zero-halogen solder paste, specifically engineered to meet the demanding requirements of miniLED, microLED, die attach, micro BGA, and HDI board applications. Its formulation allows for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter, setting a new industry standard in miniaturization and precision.
Key features of the NC259FPA Ultrafine No Clean Solder Paste include:
- Excellent Wetting: Ensures strong, reliable joints for long-term performance.
- High Transfer Efficiency: Optimizes material usage and reduces waste, making it a cost-effective solution.
- High Reliability: Meets the rigorous standards required in high-performance electronics manufacturing.
- High Tack Force for Mass Transfer: Ideal for intricate miniLED and microLED applications.
The award highlights AIM Solder’s commitment to advancing solder technology and its dedication to supporting the evolving needs of the electronics manufacturing sector.
“We are thrilled to receive this award," said Michael Zou, Lighting and Display Business Manager at AIM Solder. "The NC259FPA paste represents a feat of innovation. We’ve been very proud of its performance and the results our customers are seeing with it.”
Share on:
Suggested Items
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
SolderKing Celebrates a Year of Expansion, Innovation, and Sustainability Achievements
12/09/2024 | SolderKing Assembly Materials Ltd,SolderKing Assembly Materials Ltd, a leading UK-based manufacturer of soldering materials and consumables, has wrapped up 2024 with a series of milestones that reflect its ongoing growth and commitment to innovation.