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AIM Solder’s New NC259FPA Ultrafine No Clean Solder Paste Wins MiniLED Materials Award at Hangjia
December 15, 2023 | AIMEstimated reading time: 1 minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is proud to announce that its groundbreaking product, NC259FPA Ultrafine No Clean Solder Paste, has been honored with the Most Influential MiniLED Materials Award at the recent Hangjia Aurora Awards Ceremony. This prestigious accolade was presented during the annual Mini/Micro LED Conference held in Hangjia, China.
The NC259FPA is a zero-halogen solder paste, specifically engineered to meet the demanding requirements of miniLED, microLED, die attach, micro BGA, and HDI board applications. Its formulation allows for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter, setting a new industry standard in miniaturization and precision.
Key features of the NC259FPA Ultrafine No Clean Solder Paste include:
- Excellent Wetting: Ensures strong, reliable joints for long-term performance.
- High Transfer Efficiency: Optimizes material usage and reduces waste, making it a cost-effective solution.
- High Reliability: Meets the rigorous standards required in high-performance electronics manufacturing.
- High Tack Force for Mass Transfer: Ideal for intricate miniLED and microLED applications.
The award highlights AIM Solder’s commitment to advancing solder technology and its dedication to supporting the evolving needs of the electronics manufacturing sector.
“We are thrilled to receive this award," said Michael Zou, Lighting and Display Business Manager at AIM Solder. "The NC259FPA paste represents a feat of innovation. We’ve been very proud of its performance and the results our customers are seeing with it.”
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