Defense Speak Interpreted: Is DARPA Still Around After CHIPS?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
DOD Awards $46.2 Million to Revitalize the U.S. Defense Industrial Base On-Shoring of Advanced Packaging and Assembly
December 22, 2023 | U.S. DoDEstimated reading time: 1 minute
The Department of Defense announced an award of $46.2 million to GreenSource Fabrication LLC (GreenSource) via the Defense Production Act Investment (DPAI) Program. The award will enhance existing production capabilities at a manufacturing facility of state-of-the-art integrated circuits (IC) substrate, high-density interconnect (HDI) and ultra-high-density interconnect (UHDI), and advanced packaging.
"Re-shoring advanced packaging and assembly are essential to increase semiconductor supply chain security," said Dr. Laura Taylor-Kale, Assistant Secretary of Defense for Industrial Base Policy. "Expanding domestic production capability for printed circuit boards and advanced packaging is necessary to avert a shortfall that would severely impair national defense capability."
The award will enable GreenSource to scale up engineering, tooling, and manufacturing operations to establish a dedicated facility for IC substrate fabrication for a high-mix, low-volume offering of advanced interconnect solutions. These domestic production capabilities for HDI, UHDI, IC substrates, and advanced packaging are critical enabling technologies for sixth-generation systems and applications, including for radar, electronic warfare, information processing, and communications.
In calendar year 2023, the DPAI Program made 25 awards totaling $781 million. DPAI is overseen by the ASD(IBP)’s Manufacturing Capability Expansion and Investment Program (MCEIP), in the Office of the Deputy Assistant Secretary of Defense for Industrial Base Resilience.
Share on:
Suggested Items
PCBAA Wins Summit Silver Award from the American Society of Association Executives
07/18/2025 | PCBAAPCBAA was one of 38 associations that earned Silver Awards for outstanding contributions for an entry titled: Chips Don’t Float: More Printed Circuit Boards Must be Made in America.
TT Electronics Secures Multi-Million-Pound Defense Contract with Ultra PCS
07/18/2025 | TT ElectronicsTT Electronics, a leading provider of global manufacturing solutions and engineered technologies, announced that it has been awarded a significant new contract with long-standing customer Ultra PCS Ltd (Ultra Precision Control Systems).
HANZA Accelerates the LYNX Program Through Acquisition of Defense Manufacturer
07/18/2025 | HANZAHANZA AB has signed an agreement to acquire the contract manufacturing division of Milectria, a group of companies focused on the defense sector.
The Government Circuit: Three Inescapable Conclusions About Global Trade Policies
07/17/2025 | Chris Mitchell -- Column: The Government CircuitAmid a series of recent moves by U.S. President Donald Trump to escalate trade policy pressure on key U.S. partners, including Europe, Canada, Mexico, Japan, and Malaysia, the Global Electronics Association’s recent report on global trade flows in the electronics industry is overflowing with relevant insights. The main message is that electronics supply chains are more globally integrated than any other industry, surpassing even the automotive sector in cross-border complexity.
AIRO to Expand U.S. Manufacturing Footprint to Accelerate Advanced Drone Innovation and Strengthen Global Defense Capabilities
07/14/2025 | BUSINESS WIREAIRO, a global leader in advanced aerospace and defense technologies, announced plans to expand its U.S. footprint with the addition of a new manufacturing and engineering development facility.