Defense Speak Interpreted: Is DARPA Still Around After CHIPS?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
DOD Awards $46.2 Million to Revitalize the U.S. Defense Industrial Base On-Shoring of Advanced Packaging and Assembly
December 22, 2023 | U.S. DoDEstimated reading time: 1 minute
The Department of Defense announced an award of $46.2 million to GreenSource Fabrication LLC (GreenSource) via the Defense Production Act Investment (DPAI) Program. The award will enhance existing production capabilities at a manufacturing facility of state-of-the-art integrated circuits (IC) substrate, high-density interconnect (HDI) and ultra-high-density interconnect (UHDI), and advanced packaging.
"Re-shoring advanced packaging and assembly are essential to increase semiconductor supply chain security," said Dr. Laura Taylor-Kale, Assistant Secretary of Defense for Industrial Base Policy. "Expanding domestic production capability for printed circuit boards and advanced packaging is necessary to avert a shortfall that would severely impair national defense capability."
The award will enable GreenSource to scale up engineering, tooling, and manufacturing operations to establish a dedicated facility for IC substrate fabrication for a high-mix, low-volume offering of advanced interconnect solutions. These domestic production capabilities for HDI, UHDI, IC substrates, and advanced packaging are critical enabling technologies for sixth-generation systems and applications, including for radar, electronic warfare, information processing, and communications.
In calendar year 2023, the DPAI Program made 25 awards totaling $781 million. DPAI is overseen by the ASD(IBP)’s Manufacturing Capability Expansion and Investment Program (MCEIP), in the Office of the Deputy Assistant Secretary of Defense for Industrial Base Resilience.
Share on:
Suggested Items
Teledyne FLIR’s Black Hornet 4 Nano-Drone Approved for Defense Innovation Unit’s Blue UAS List
06/25/2025 | BUSINESS WIRETeledyne FLIR Defense, part of Teledyne Technologies Incorporated, announced that its Black Hornet® 4 Personal Reconnaissance System has successfully completed the required NDAA and cyber security verification process and been approved for the Blue UAS List with an Authority to Operate.
Neways, Teledyne FLIR Sign Frame Agreement for Ramp-up of Defense Business
06/21/2025 | NewaysNeways, the global innovator in mission-critical technology for leading semicon, defense & mobility, and connectivity companies, has signed a frame agreement with Teledyne FLIR. Teledyne FLIR is a global leader in thermal imaging infrared cameras that are applied in government & defense, industrial, and commercial markets.
RTX, the Singapore Economic Development Board Sign MOU Outlining 10-year Growth Roadmap
06/20/2025 | RTXRTX and the Singapore Economic Development Board (EDB) have signed a Memorandum of Understanding (MoU) which outlines a 10-year roadmap to further long-term strategic collaboration in Singapore.
Lockheed Martin Delivers Eighth U.S. Terminal High Altitude Area Defense Battery
06/20/2025 | Lockheed MartinLockheed Martin has delivered the Minimum Engagement Package (MEP) of the eighth Terminal High Altitude Area Defense (THAAD) battery to the U.S. government.
Industry Partners Launch Joint Venture Company Edgewing to Deliver Next Generation Combat Aircraft
06/20/2025 | BAE SystemsA new chapter in global defence collaboration began with the official launch of Edgewing, a joint venture bringing together international aerospace leaders BAE Systems (UK), Leonardo (Italy) and Japan Aircraft Industrial Enhancement Co. Ltd. (Japan).