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Standard of Excellence: Collaboration—The Right Path to Innovation

05/15/2024 | Anaya Vardya -- Column: Standard of Excellence
Now more than ever, as new and innovative technologies for printed circuit boards are in demand, we need collaboration between PCB designers, fabricators, and assemblers. Close partnerships with PCB designers and assemblers are key to developing and producing PCBs with boards with new and innovative technology. These collaborative partnerships, along with the partnership with the end customers, are more critical than ever before.

Listen Up: Popular Podcast Series Returns With Discussion of Electroless Copper

05/16/2024 | I-Connect007
In the latest episode of the podcast series, On the Line With: Designing for Reality, Nolan Johnson returns to Sunstone Circuits in Mulino, OR, to continue down the manufacturing process with Matt Stevenson.

Breaking High-speed Material Constraints: Design007 Magazine — May 2024

05/14/2024 | I-Connect007 Editorial Team
Do you need specialty materials for your high-speed designs? Maybe not. Improvements in resins mean designers of high-speed boards can sometimes use traditional laminate systems instead of high-speed materials, saving time and money while streamlining the fab process. In the May 2024 issue of Design007 Magazine, our contributors explain how to avoid overconstraining your materials when working with high-speed boards.

IDENTCO Highlights Automation Capabilities and PCB Labeling at PCB East

05/13/2024 | IDENTCO
IDENTCO – a manufacturer of high-performance labeling solutions for the power equipment, electronics, transportation, and general industrial sector – will highlight its automation capabilities and PCB labeling solutions at PCB East, June 4-7 in Boxborough, MA, Booth #301.

ASMC 2024 Opens With AI, Smart Manufacturing and Sustainability in Focus

05/13/2024 | SEMI
The 35th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2024) opens today to focus on critical topics ranging from yield management and metrology to new developments in artificial intelligence, smart manufacturing and sustainability.
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