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BEST Inc. Presents StencilQuik for Simplifying BGA Rework Challenges

04/02/2025 | BEST Inc.
BEST Inc., a leader in electronic component rework services, training, and rework tools is thrilled to announce StencilQuik™ rework stencils. This innovative product is specifically designed for placing Ball Grid Arrays (BGAs) or Chip Scale Packages (CSPs) during the rework process.

Knocking Down the Bone Pile: Basics of Component Lead Tinning

04/02/2025 | Nash Bell -- Column: Knocking Down the Bone Pile
The component lead tinning process serves several critical functions, including removing gold plating, mitigation of tin whiskers, reconditioning of component solderability issues, and alloy conversion from lead-free (Pb-free) to tin-lead or from tin-lead to lead-free for RoHS compliance. We will cover each of these topics in more detail in upcoming columns.

Real Time with... IPC APEX EXPO 2025: MKS' Atotech—Leading Innovations in Semiconductor Solutions

03/28/2025 | Real Time with...IPC APEX EXPO
In this interview, Marcy LaRont speaks with Kuldip Johal, CTO, MKS’ Atotech. Based in Boston, MKS operates in vacuum solutions, photonics, and specifically for the Atotech division, material solutions.  MKS significantly impacts the semiconductor industry, supplying components for up to 85% of global semiconductor tools and covers processes and materials for 70% of PCB manufacturing steps.

KYZEN to Highlight Stencil and Cleaning Solutions at SMTA Monterrey

03/27/2025 | KYZEN'
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum scheduled to take place on Thursday, April 10 at the Cintermex Convention Center in Monterrey, Nuevo León. KYZEN cleaning experts will be on-site highlighting stencil cleaning chemistries KYZEN E5631J and CYBERSOLV C8882.

HARTING 3D-Circuits Leads 3D-MID Innovation: Transforming Consumer Electronics with Advanced Technology

03/27/2025 | PRNewswire
The consumer electronics industry is experiencing a remarkable transformation, propelled by rapid technological advancements and an increasing demand for compact, efficient, and multifunctional devices. Central to this evolution is 3D-MID (Three-Dimensional Mechatronic Integrated Devices) technology, which redefines design standards and drives innovation.
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