Marcy’s Musings: Advancing the Advanced Materials Discussion
The Marketing Minute: Cracking the Code of Technical Marketing
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
SCHMID Group Presents Breakthrough Solutions for Substrate Production at ISES USA
April 9, 2024 | SCHMID GroupEstimated reading time: 1 minute
The SCHMID Group, a global leader in providing solutions to the high-tech electronics, photovoltaics, glass, and energy systems industries participated in the International Semiconductor Executive Summit (ISES) USA this week. As a renowned innovator and technology partner, SCHMID presented groundbreaking insights on solutions for substrate production including organic and glass substrates, as well as details around their embedded trace (ET) process.
In this dynamic session entitled “Solutions for Substrate Production”, Laurent Nicolet, SCHMID Group’s Electronics Vice President, elaborated on the challenges facing traditional organic and next generation glass substrate production and how SCHMID solves these problems for the industry.
Key Highlights:
- Driven by increasing chiplet requirements for high-end performance applications, like AI, new substrate materials and technologies are needed to support miniaturization, integration, performance, thermal management, high frequency capabilities, speed, and energy efficient components and systems.
- SCHMID’s breakthrough ET process opens new design opportunities for next generation substrates that enable manufactures to produce the most advanced substrates below two microns on glass or organics.
- Glass substrates, which exhibit superior thermal and dimensional properties, exceptional dielectric characteristics and capacity for increased chiplet integration, and greater COWOS design flexibility are possible with ET.
- Offering more than 70% of processes and equipment needed, substrate manufacturers can collaborate with a single supplier for both equipment and process solutions to streamline their operations.
Christian Schmid, SCHMID Group Chief Executive Officer, commented “Nicolet’s presentation at ISES USA outlines how our proprietary ET process is at the intersection of next generation innovation, sustainability, and industry transformation alongside our customers. We are pleased with the feedback we received during the event and confident that these technologies will be integrated into future advanced IC-packaging solutions worldwide”.
SCHMID will be exhibiting at the IPC’s Apex/Expo in Annahiem, California, April 9-11, showcasing the latest equipment and process solutions for both UHDI and advanced substrates, including glass with capabilities down to 2 microns and below. See us at booth #4632.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
SCHMID Group Update on Order Situation and Market Development in 2025
05/22/2025 | SCHMID GroupFollowing a challenging year in 2024, which was particularly affected by the ongoing trade conflict between the USA and China, the SCHMID Group is now experiencing a welcome turnaround. Incoming orders are currently within the expected range, confirming the positive market trend that began to emerge at the end of 2024.
TRUMPF, SCHMID Group Enable Cost-effective High-speed Chips
01/24/2025 | SCHMID GroupTRUMPF and the SCHMID Group are developing an innovative manufacturing process for the latest microchip generation for the global chip industry.
SCHMID Group Honored with 'Best New Partner Award' from Founder PCB
01/14/2025 | SCHMID GroupThe SCHMID Group is proud to announce that it has been honored with the prestigious “Best New Partner Award” from Founder PCB. This esteemed recognition highlights the success of a strong partnership and the shared pursuit of excellence that defines our collaboration.
SCHMID Group Opens New Branch in Asia-Pacific – SCHMID Asia Pacific
10/30/2024 | SCHMID GroupThe SCHMID Group is pleased to announce the official opening of its newest division, SCHMID Asia Pacific Sdn Bhd. As of November 1, 2024, the new division will begin operations, providing comprehensive services and solutions to customers across the Asia-Pacific region.
SCHMID Group Takes Next Step Towards Advanced Packaging for Integrated Circuits with Glass Cores
05/29/2024 | GlobeNewswireSCHMID Group N.V. (Nasdaq: SHMD) announces taking next step towards advanced packaging for integrated circuits with glass cores. Together with partners, the SCHMID Advanced IC Packaging Lab Solution is currently the sole supplier for full TGV lab with all process steps necessary to turn a bare glass substrate into an Advanced Integrated Circuit (IC) Package.