-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
IPC Announces New Board Members at IPC APEX EXPO 2024
April 10, 2024 | IPCEstimated reading time: 1 minute
At the 67th IPC Annual Meeting on April 9, held in conjunction with IPC APEX EXPO 2024, the IPC Board of Directors announced new officers and new and second-term members. Board officers serve a two-year term, board members serve a four-year term, and the student board member serves a one-year term.
The newly elected Board officers are:
- IPC Board Chair: Tom Edman, President and CEO, TTM Technologies
- IPC Board Vice Chair: Jeff Timms, CEO, ASMPT SMT USA LLC
- IPC Board Secretary/Treasurer: Peter Cleveland, Senior Vice President, TSMC
First time Board members are:
- Gerald "JJ " Creadon, Executive Vice President, Operations, Jabil
- Gerald Eckstein, Senior Vice President, Engineering Electronic Control Units & Head of Business Unit Mechatronics, Robert Bosch GmbH
- Parker Garrett, CEO, EMSCO
- Greg Maxwell, Vice President, Advanced & Strategic Global Supply Chain for Operations, Northrop Grumman Mission Systems
- Jaesang Min, Research Fellow, LG PRI (Production Engineering Research Institute)
Second term Board members are:
- Marc Peo, President, Heller Industries
- Hiroyuki Watanabe, Executive Vice President and Member of the Board for New Business and Sales, NEC Corporation
Student Board member is:
- Junyang (Max) Zhang, University of California, Irvine
"IPC is privileged to have these outstanding professionals on our current slate of Board members," said John W. Mitchell, IPC president and CEO. "We look forward to working with them as we advance the global electronics industry and build electronics better."
In addition to Board election announcements, IPC honored six outgoing Board Members:
- Henry Crandall, Ph.D. Candidate, University of Utah
- Joe DeMan, President, Interconnect Dynamics - An Amphenol Global Solutions Provider
- Robert Feuerstein, Chief Information Security Officer, Group Sector Automotive, Continental AG
- Steve Pudles, Board of Directors and Advisor, Zentech Manufacturing, Inc.
- Lisa Weeks, SVP, Chief Strategy Officer and Head of Investor Relations, Benchmark Electronics
- Shane Whiteside, President and CEO, Summit Interconnect
Added Mitchell, "IPC expresses its sincere gratitude to Henry, Joe, Robert, Steve, Lisa and Shane for their dedicated service to the IPC Board. All have shared their expertise with IPC and industry - we thank them for imparting their knowledge and helping guide IPC to best serve our members and the global electronics community."
Suggested Items
High Density Packaging User Group (HDP) Welcomes Lincstech as New Member
07/01/2025 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.
Zhen Ding's 2025 Lean & Digital Initiative Presentation Conference Concludes Successfully, Driving Group Transformation
07/01/2025 | Zhen DingTo advance its digital transformation strategy and embody the CA- PDCA continuous improvement philosophy, Zhen Ding Technology Group (Zhen Ding) successfully hosted the 2025 H1 Lean & Digital Initiative Presentation Conference.
PCBA Market to Reach $147.5 Billion by 2035, Growing at a CAGR of 4.7% from 2025
06/27/2025 | PRNewswireThe Printed Circuit Board Assembly market is projected to reach $147.5 billion by 2035, up from an estimated $90.91 billion in 2025, growing at a steady CAGR of 4.7% during the forecast period.
North American PCB Industry Sales Up 21.4% in May
06/20/2025 | IPCIPC announced the May 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.03.
Connect the Dots: The Future of PCB Design and Manufacturing
07/02/2025 | Matt Stevenson -- Column: Connect the DotsFor some time, I have been discussing the increasing complexity of PCBs and how designers can address the constantly evolving design requirements associated with them. My book, "The Printed Circuit Designer’s Guide to… Designing for Reality," details best practices for creating manufacturable boards in a modern production environment.