Dan’s Biz Bookshelf: ‘Elevate: Push Beyond Your Limits'
The Marketing Minute: The First Step to More Sales—Marketing
It’s Only Common Sense: Customer Service Is Sales in Disguise
North American PCB Industry Sales Up 21.4% in May
June 20, 2025 | IPCEstimated reading time: 2 minutes
IPC announced the May 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.03.
Total North American PCB shipments in May 2025 were up 21.4 percent compared to the same month last year. Compared to the preceding month, May shipments were up 7.1 percent. May's year-to-date (YTD) shipments increased by 7.9% year-over-year (YOY).
PCB bookings in May were up 9.5 percent compared to the same month last year. May bookings were down 12.9 percent compared to the preceding month. May’s YTD bookings increased 18.3% compared to the same period last year.
“North American PCB shipments continued their upward trajectory in May, reflecting strong demand and improving supply chain dynamics. While bookings slowed from the previous month, indicating some near-term cooling in new orders, year-over-year growth remains solid. Demand is largely keeping pace with supply, pointing to a stable near-term outlook,” said Shawn DuBravac, IPC’s chief economist.
Detailed Data Available
Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.
Interpreting the Data
The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.
Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.
IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.
Share on:
Suggested Items
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
Technica USA Introduces Frank Silva as PCBA Representative for Southern CA and Southern NV Territories
07/16/2025 | Technica USATechnica USA is pleased to announce the partnership with veteran Frank Silva as our PCBA Sales Representative, supporting both supply partners and PCBA customers across Southern California and Southern Nevada.
Beyond Design: Refining Design Constraints
07/17/2025 | Barry Olney -- Column: Beyond DesignBefore starting any project, it is crucial to develop a thorough plan that encompasses all essential requirements. This ensures that the final product not only aligns with the design concept but is also manufacturable, reliable, and meets performance expectations. High-speed PCB design requires us to not only push technological boundaries but also consider various factors related to higher frequencies, faster transition times, and increased bandwidths during the design process.
Prague PEDC: Call for Abstracts Deadline July 31
07/16/2025 | Pan-European Electronics Design Conference (PEDC)The second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline is July 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
The Pulse: Design Constraints for the Next Generation
07/16/2025 | Martyn Gaudion -- Column: The PulseIn Europe, where engineering careers were once seen as unpopular and lacking street credibility, we have been witnessing a turnaround in the past few years. The industry is now welcoming a new cohort of designers and engineers as people are showing a newfound interest in the profession.